Company patents
DUPONT ELECTRONICS, INC.
DUPONT ELECTRONICS, INC. appears to be strategically shifting its focus, with a surprising decline in its core materials categories like Polymer Working & Compounding, which saw a -100.0% YoY drop in 2026 so far, and Polymer Synthesis (Polycondensation) with a -57.1% YoY decline in 2025. Conversely, the company is showing an emerging focus on semiconductor technologies, with Printed Circuits & Electronic Assemblies experiencing a significant +66.7% YoY growth in 2026 so far, despite a previous -75.0% drop in 2024, and Photolithography showing a remarkable +300.0% YoY growth in 2024.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
90 US filings (since 2023) · 12 categories · 27 themes
Synthesis and formulation of polymers, such as epoxy resins, polyimides, or ionic binders, tailored for specific functions in electronic components like sealing, insulation, or energy storage.
Techniques for manufacturing thin polymer layers, sheets, or multi-layer structures, often optimized for specific properties such as flexibility, barrier function, filtration, or mechanical strength.
Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.
Novel formulations and mechanisms for initiating or controlling the polymerization and cross-linking of adhesives, including dual-curing systems, radical polymerization, and partial curing for tailored material properties.
Development of polymer compositions and material structures for electrical insulation and protective sheathing of cables, focusing on properties like flame retardancy, flexibility, and semiconductivity.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Polymer compositions incorporating inorganic or organic filler materials to impart specific functional properties such as thermal conductivity, flame retardancy, electrical conductivity, or enhanced mechanical strength and dimensional stability.
Polymer compositions engineered for enhanced heat resistance, thermal stability in molten states, or improved processability at high temperatures, often involving specific copolymers, blends, or stabilizing additives for applications in electronics or automotive.
Development of new conductive materials, including powders, composites, and alloys, designed for specific electrical performance, manufacturing processes, or applications beyond basic copper wires.
Methods and apparatus for disinfecting or sterilizing medical devices, waste, or environments, often employing radiation, chemical agents, or thermal processes, and including monitoring systems.
Light-initiated polymerization processes used to create structures, coatings, or components, particularly for electronic devices, displays, or additive manufacturing, often involving photoinitiators and specific monomer/oligomer compositions.
Additives or compositions specifically formulated for surface application or modification to impart protective, decorative, or specialized functional properties to polymer products.
Development of novel chemical compositions for photoresists, including polymers, sensitizers, and crosslinking agents, to achieve improved lithographic performance such as resolution, sensitivity, line edge roughness, and etch resistance.
Systems and components for storing, delivering, circulating, and managing printing liquids (e.g., ink) to the printhead, often including features for pressure regulation, filtration, degassing, and balancing liquid levels.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.
Layered glass or film structures designed to optimize optical (e.g., light transmission, reflection, diffusion) and/or thermal (e.g., insulation, heat reflection/absorption) performance in windows, displays, and lighting applications.
Mechanisms and methods for preventing or removing clogs, ink residue, or contaminants from printhead nozzles and surfaces to ensure consistent print quality and extend printhead lifespan.
Development and application of polymer compositions designed for reprocessability, recyclability, or incorporating sustainable additives, often featuring reversible bonds or bio-based components.
Multi-layer polymer films engineered to provide superior barrier properties against gases (e.g., oxygen), moisture, or aromas, often incorporating heat-sealing or resealing mechanisms for food and product preservation.
Polymer compositions tailored for medical and biological applications, including implantable devices, drug delivery systems, and diagnostic tools, emphasizing properties like biocompatibility, hydrolysis resistance, optical clarity, and specific mechanical characteristics.
Design aspects of user-replaceable cartridges or containers for printing consumables (e.g., ink, tape, labels) that facilitate easy installation, proper positioning, type identification, and reliable supply to the printer.
Synthesis and modification of polysiloxane polymers to introduce specific functional groups or structures, enhancing properties for applications like composites, coatings, biomedical uses, or powder treatment.
Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.
Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.
Polymer compositions designed to change their properties (e.g., shape, optical transmittance, solubility) in response to external stimuli such as pH, temperature, light, or chemical presence, enabling applications in sensors, smart windows, or controlled release.
Structural design and manufacturing techniques for bundling multiple wires into harnesses, including protective layers like braiding and interlocking armor, and methods for assembly and termination.
Patents
Showing 1-10 of 17
Flexible and Printed Circuitry