Company patents
E Ink Holdings Inc.
E Ink Holdings Inc. demonstrates a dynamic patent strategy, with a significant 25.5% of its portfolio in Optical Elements & Systems, which saw a remarkable 166.7% growth in 2024, indicating an emerging focus beyond its core display technologies. Conversely, the sharp decline in Integrated Circuit Layout & Arrangement, with an 85.7% drop in 2025 and zero patents so far in 2026, suggests a shifting priority away from this semiconductor design area.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
243 US filings (since 2023) · 12 categories · 21 themes
Innovations in backlight units, optical films, and light management structures to enhance display performance, uniformity, viewing experience, or specific functionalities like touch.
Techniques for driving electrophoretic displays, including managing remnant voltage, optimizing particle movement, and specific addressing pulse schemes to improve optical quality and update speed.
Physical layout and material composition of individual pixels within a display panel, including active layers, electrodes, light-emitting elements (LEDs, OLEDs), and associated thin-film transistors (TFTs).
Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.
Systems that combine light sources, waveguides, and display elements into unified products for backlighting, automotive applications, general lighting, or color-corrected displays.
Design and implementation of circuits and layouts for driving individual pixels or rows/columns of pixels, including gate drivers, data drivers, pixel driving circuits, and their integration onto the display substrate, often in non-display regions.
Methods and circuits for coordinating the timing of display signals, data transmission, and control signals across various display components, ensuring proper image rendering and efficient operation.
Integration of various sensor types (e.g., thermal, strain) or display components directly onto semiconductor substrates or within device architectures for compact and high-performance systems.
Techniques and circuits for optimizing power consumption, voltage stability, and energy efficiency in display panels, often involving dynamic voltage scaling, duty cycle control, or remnant voltage management.
Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.
Optical and pixel-defining materials for display panels, including black matrix compositions, color filter pigments, optical alignment films, and pixel-define layers.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Algorithms and hardware implementations within display drivers or associated components to enhance visual quality, resolution, or color reproduction, including upscaling, dithering, and compensation for display artifacts like crosstalk.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Focuses on the design and manufacturing of transistors where the gate material fully encircles the channel, often using nanosheets or fins, to improve electrostatic control and reduce short-channel effects.
Layered glass or film structures designed to optimize optical (e.g., light transmission, reflection, diffusion) and/or thermal (e.g., insulation, heat reflection/absorption) performance in windows, displays, and lighting applications.
Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Patents
Showing 1-10 of 18
Advanced Electronic Packaging