Company patents
EBARA CORPORATION
EBARA CORPORATION's patent strategy reveals a strong, albeit fluctuating, commitment to core manufacturing processes like Grinding & Polishing (39.6% of portfolio) and Semiconductor Manufacturing Process (26.9%), both of which saw significant patenting activity in 2024 with +49.3% and +26.8% YoY growth respectively, before experiencing a notable decline in 2025 and so far in 2026. Interestingly, while most categories show a recent slowdown, Industrial Control Systems is an emerging focus, demonstrating a +20.0% YoY growth so far in 2026, contrasting with the overall trend.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
713 US filings (since 2023) · 12 categories · 26 themes
Methods and apparatus for cleaning polishing pads, dressers, chamber components, or finished substrates to remove residues, debris, or contaminants, often involving specialized nozzles, fluids, or mechanical actions.
Specialized cleaning techniques and apparatus designed for removing microscopic contaminants, residues, or films from sensitive substrates, such as semiconductor wafers or flat panel displays, often involving chemical, mechanical, or plasma-based methods.
Processes involving chemical and mechanical forces to planarize surfaces (CMP) or wet chemical treatments for cleaning, etching, or material removal, often utilizing specialized compositions, nozzles, or fluid management systems.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Focuses on the chemical and physical properties of polishing slurries and the design of polishing pads, including their material composition, groove patterns, and thermal characteristics, to optimize chemical-mechanical planarization processes.
Techniques and devices for measuring, monitoring, and controlling the surface topography, film thickness, or other characteristics of a workpiece during or after grinding/polishing to achieve specific finish requirements.
Pumps and blowers specifically adapted or designed for unique fluid types, challenging environments, or particular industrial, medical, or consumer applications, often involving debris, specific gas mixtures, or precise delivery requirements.
Integration of robotics, sensors, and control systems to automate the grinding, polishing, or deburring process, including workpiece handling, tool adjustment, and system maintenance for improved efficiency and precision.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Methods and components for converting power into mechanical motion to drive pump mechanisms, encompassing electric motors, hydraulic actuators, and specialized motion converters like ball screws or solenoids.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Innovations in the design, materials, and maintenance of seals, valves, and related components to improve durability, reduce leakage, and enable specific pump functions like high-pressure operation or automated seal replacement.
Focuses on optimizing the geometry, structure, and internal flow channels of impellers, blades, and housings to improve fluid dynamics, efficiency, or specific performance characteristics of centrifugal pumps and fans.
Techniques for building three-dimensional metal objects layer-by-layer using metal powders, including powder bed fusion, binder jetting, and directed energy deposition. This theme encompasses process mechanics, equipment design, and operational control for AM systems.
Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.
Systems and methods for monitoring, regulating, and diagnosing the performance and health of pumps and fans, including speed control, flow rate management, abnormality detection, and safety mechanisms like overspeed safeguards.
Computational methods and design principles for generating optimized geometries, internal structures (e.g., lattices, minimal surfaces), or functional features that are specifically enabled or enhanced by the capabilities of additive manufacturing.
Methods and systems for detecting fluid or gas leaks, or assessing the quality and continuity of seals in containers, systems, or structures. This often involves pressure changes, electrical properties, or acoustic analysis.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Technologies for removing contaminants from critical surfaces of sensors, vehicle parts, or industrial components, often involving automated or semi-automated processes. This can include physical, acoustic, or fluid-based methods to maintain functionality.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Methods and devices that determine the position, angle, or distance of an object by detecting changes in magnetic fields or inductive coupling.
Integration of additive manufacturing with subtractive manufacturing (e.g., machining, cutting) or other traditional processes within a single system or workflow to create parts with improved features, surface finish, or material properties, or to enable new manufacturing paradigms.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Utilizing sound and vibration analysis to detect malfunctions, assess balance, or monitor the operational health of machinery and structures. This often involves sensors, signal processing, and pattern recognition.
Design and application of abrasive tools and deburring heads tailored for specific geometries, materials, or access constraints, including flexible, expandable, or multi-component designs for precision finishing.
Patents
Showing 1-9 of 9
Advanced Etching & Patterning Control