ENTEGRIS, INC.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Membrane and depth filtration for industrial separation, gas purification, and bioprocess clarification including cross-flow, dead-end, tangential flow filtration, and oil/water separation.

Abrasive slurry compositions used in semiconductor manufacturing for planarizing wafer surfaces, typically containing abrasive particles and chemical additives to achieve specific material removal rates and selectivity.

Techniques for forming thin films of metal oxides or related metal compounds on substrates, often using solution-based methods, for applications in electronics, optics, or specialized coatings.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Processes involving chemical and mechanical forces to planarize surfaces (CMP) or wet chemical treatments for cleaning, etching, or material removal, often utilizing specialized compositions, nozzles, or fluid management systems.

Focuses on the chemical and physical properties of polishing slurries and the design of polishing pads, including their material composition, groove patterns, and thermal characteristics, to optimize chemical-mechanical planarization processes.

Methods and apparatus for cleaning polishing pads, dressers, chamber components, or finished substrates to remove residues, debris, or contaminants, often involving specialized nozzles, fluids, or mechanical actions.

Specific techniques and materials developed to remove persistent or difficult-to-treat pollutants from water, such as per- and polyfluoroalkyl substances (PFAS), micropollutants, or specific industrial chemicals.

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.

Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.

Development of materials with tailored porosity, surface chemistry, or structure, such as metal-organic frameworks (MOFs), zeolites, or superficially porous particles, for selective adsorption, ion exchange, or chromatographic separations.

Technologies and systems for removing unwanted components or separating desired gases from a mixed gas stream, including adsorption, absorption, and membrane-based methods.

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Organometallic or organosilicon compounds used as catalysts to facilitate polymerization reactions, such as olefin metathesis, or as crosslinkers and modifiers to enhance the properties of polymer compositions like silicones.

Containers or packaging components featuring active mechanisms for controlled release, preparation, or delivery of their contents, such as liquids, bulk materials, volatile compounds, or single-serve portions.

Large-scale processes for synthesizing, purifying, or recycling various industrial metal compounds, including sulphides, hydroxides, and sulfates, often involving chemical reactions, crystallization, or electromembrane processes.

Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.

Synthesis and processing of silicon and silicon carbide materials in various forms (e.g., particles, nanowires, films) for applications beyond traditional semiconductors, such as battery components, refractories, or advanced electronics.

Techniques for building three-dimensional metal objects layer-by-layer using metal powders, including powder bed fusion, binder jetting, and directed energy deposition. This theme encompasses process mechanics, equipment design, and operational control for AM systems.

Equipment and processes for separating solid particles from liquid or gas phases in industrial settings, encompassing mechanical screening, filtration of molten materials, and various filter media designs.

Application of protective layers to improve the durability and longevity of components by enhancing resistance to wear, oxidation, or chemical degradation in demanding operational environments.

Systems and methods specifically engineered for removing pollutants and impurities from water sources, ranging from groundwater decontamination to point-of-use filtration, often employing adsorption, membrane, or distillation techniques.

Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.

Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.

Technologies and materials for capturing carbon dioxide from gas streams and subsequently converting it into valuable chemical products or materials, rather than simply storing it.

Membrane-based separation for water purification, contaminant removal, desalination, and wastewater treatment, including reverse osmosis, ultrafiltration, and forward osmosis modules.

Multi-layer polymer films engineered to provide superior barrier properties against gases (e.g., oxygen), moisture, or aromas, often incorporating heat-sealing or resealing mechanisms for food and product preservation.

Formulated liquid compositions designed for specific industrial applications, such as non-flammable cleaning, thermal management in electronics, or as low-viscosity, high-flash-point base fluids.

Mixtures of liquid crystal compounds and other additives, such as monomers or carbon black, designed to achieve specific optical, electrical, or physical properties for use in liquid crystal displays (LCDs) or other electro-optical devices.

Development of novel chemical compositions for photoresists, including polymers, sensitizers, and crosslinking agents, to achieve improved lithographic performance such as resolution, sensitivity, line edge roughness, and etch resistance.

Structural elements within a container designed to secure, separate, cushion, or otherwise protect individual items or groups of contents from movement, shock, or damage.

Integration of additive manufacturing with subtractive manufacturing (e.g., machining, cutting) or other traditional processes within a single system or workflow to create parts with improved features, surface finish, or material properties, or to enable new manufacturing paradigms.

Packaging solutions that incorporate active components such as motors, sensors, or indicators to perform specific functions, provide feedback, or enable tracking of the container or its contents.

Household articles engineered with mechanisms for folding, retracting, or collapsing to reduce their footprint, facilitate storage, or enable portability.