Company patents
FABRIC8LABS, INC.
FABRIC8LABS, INC. demonstrates a strong, albeit potentially shifting, focus on Additive Manufacturing (3D Printing), which constitutes 71.2% of its portfolio, despite a 50.0% decline in patent filings so far in 2026. Surprisingly, the company is rapidly expanding its presence in semiconductor-related technologies, with Printed Circuits & Electronic Assemblies showing a 33.3% YoY growth in 2025 and new filings emerging in Photolithography, Semiconductor Manufacturing Process, and Semiconductor Packaging & Encapsulation in 2026, indicating an emerging focus on integrating 3D printing with advanced electronics.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
80 US filings (since 2023) · 9 categories · 11 themes
Techniques for building three-dimensional metal objects layer-by-layer using metal powders, including powder bed fusion, binder jetting, and directed energy deposition. This theme encompasses process mechanics, equipment design, and operational control for AM systems.
Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.
Integration of additive manufacturing with subtractive manufacturing (e.g., machining, cutting) or other traditional processes within a single system or workflow to create parts with improved features, surface finish, or material properties, or to enable new manufacturing paradigms.
Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.
Techniques and structures within heat exchangers designed to enhance heat transfer efficiency by controlling and optimizing fluid flow, including baffle arrangements, jet impingement, and condensate management.
Heat transfer devices that utilize the phase change of a working fluid (evaporation and condensation) to efficiently move heat, often incorporating capillary structures, heat pipes, or vapor chambers.
Development of novel chemical compositions for photoresists, including polymers, sensitizers, and crosslinking agents, to achieve improved lithographic performance such as resolution, sensitivity, line edge roughness, and etch resistance.
Patents
Showing 1-4 of 4
Two-Phase Cooling Devices