Company patents
FCI USA LLC
FCI USA LLC's patent strategy is overwhelmingly concentrated in Electrical Connectors, representing 91.5% of its portfolio, yet this core area has seen significant volatility with a 48.1% decline in 2024 followed by an 85.7% surge in 2025, and a sharp 69.2% drop so far in 2026. While Printed Circuits & Electronic Assemblies is a minor part of their portfolio at 9.8%, it experienced a remarkable 300.0% growth in 2025, indicating a potential, albeit small, emerging focus despite a subsequent decline so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
82 US filings (since 2023) · 2 categories · 8 themes
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Design techniques and components within connectors to minimize signal degradation, crosstalk, and impedance mismatches for high-frequency data transmission.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Patents
Showing 1-10 of 122