Company patents
Flex Ltd.
Flex Ltd.'s patent strategy shows a surprising shift away from its core semiconductor and manufacturing categories, with 'Printed Circuits & Electronic Assemblies' declining by 66.7% in 2025 and 'Plastics Shaping & Molding' by 100.0% in 2025. While most categories have seen significant declines, there's a notable resurgence in 'Power Conversion (DC/AC, DC/DC)' with 3 patents so far in 2026 after a 100.0% decline in 2025, suggesting a potential re-emphasis on electrical power technologies.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
48 US filings (since 2023) · 12 categories · 22 themes
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.
Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.
Systems and methods for transferring electrical energy without physical contact, often utilizing inductive or resonant coupling, including antenna design, resonance tracking, and control mechanisms for efficient power delivery.
Design and control of power supply architectures that combine multiple power sources (e.g., AC grid, DC battery, generators) or modular battery units, often featuring switching, conversion, and redundancy for enhanced reliability and flexibility.
Mechanical or electromechanical systems designed for precise, often self-administered, delivery of medicaments, including features for dose setting, needle insertion/retraction, and safety mechanisms to prevent premature activation.
Apparel or accessories that incorporate electronic components such as sensors, communication modules, haptic feedback devices, or processing units for enhanced functionality and interaction.
Integration of power converters with energy storage devices (batteries, supercapacitors) or grid interfaces, often involving AC/DC conversion, power flow management, and fault handling for hybrid power systems or specific applications like EVs or PV.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Methods and compositions for applying metallic or alloy layers to a substrate, or modifying the surface of an alloy, to impart specific functional properties such as corrosion resistance, wear resistance, electrical insulation, or improved adhesion, without altering the bulk properties significantly.
Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.
Methods and equipment for continuously shaping plastic materials by forcing them through a die, often involving screw extruders, heating elements, and downstream calibration.
Development of devices and methods for non-invasive or minimally invasive collection and analysis of physiological data, often from wearable sensors, to monitor health, activity, or specific conditions.
Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.
Systems and methods for precisely controlling welding parameters such as power, speed, oscillation, and material feed to optimize weld quality, consistency, and efficiency, often involving automated or semi-automated processes.
Development and application of textile materials with engineered properties such as waterproofing, thermal regulation, anti-cling, structural coloration, or enhanced filtration capabilities for specific performance needs.
Patents
Showing 1-3 of 3
Multi-material Product Integration & Finishing