Company patents
FLOSFIA INC.
FLOSFIA INC. shows a surprising shift in its patent strategy, with a significant decline in its core semiconductor categories like Transistor & Device Structure (down 90.0% in 2025) and Semiconductor Manufacturing Process (down 75.0% in 2025) after strong growth in 2024. This suggests a potential re-evaluation of priorities, especially given the emergence of Semiconductor Diodes & Transistors with 8 patents in 2025, representing a new focus within its semiconductor portfolio, though this also saw a sharp decline so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
65 US filings (since 2023) · 12 categories · 11 themes
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Development and manufacturing of semiconductor devices using wide bandgap materials like Silicon Carbide (SiC) or Gallium Nitride (GaN) for high-power, high-frequency, or high-temperature applications.
Incorporation of novel semiconductor, dielectric, or metallic materials into transistor structures to achieve enhanced performance, new functionalities, or specific device characteristics.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.
Automated methods and tools for generating, optimizing, and verifying the physical layout and interconnections of electronic components, including integrated circuits, printed circuit boards, and system-level interface protection.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Patents
Showing 1-3 of 3
Electronic System Layout & Integration