Company patents
FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD. surprisingly shows an emerging focus on Pipes & Tubing, with 6 patents filed so far in 2026, representing a significant shift from zero filings in the previous three years, despite its core Electrical Connectors category experiencing a -33.8% decline in filings so far in 2026 after a 32.7% growth in 2025.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
259 US filings (since 2023) · 5 categories · 12 themes
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Structural design and manufacturing techniques for bundling multiple wires into harnesses, including protective layers like braiding and interlocking armor, and methods for assembly and termination.
Design techniques and components within connectors to minimize signal degradation, crosstalk, and impedance mismatches for high-frequency data transmission.
Development of polymer compositions and material structures for electrical insulation and protective sheathing of cables, focusing on properties like flame retardancy, flexibility, and semiconductivity.
Mechanisms allowing rapid, secure, and often sealed attachment and detachment of pipes, tubes, or hoses, frequently featuring locking, sealing, and release components for efficient assembly and maintenance.
Couplings and fittings designed for specific fluid properties (e.g., cryogenic, chemical, medical, high-pressure) or requiring aseptic conditions, low-spill characteristics, or antimicrobial features to ensure safety and integrity.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Development of new conductive materials, including powders, composites, and alloys, designed for specific electrical performance, manufacturing processes, or applications beyond basic copper wires.
Patents
Showing 1-10 of 479