Frore Systems Inc.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.

Heat transfer devices that utilize the phase change of a working fluid (evaporation and condensation) to efficiently move heat, often incorporating capillary structures, heat pipes, or vapor chambers.

Design and integration of thermoelectric modules for converting heat into electricity (power generation) or using electricity for cooling/heating, often involving p-type/n-type semiconductor pellets and waste heat recovery.

Techniques and structures within heat exchangers designed to enhance heat transfer efficiency by controlling and optimizing fluid flow, including baffle arrangements, jet impingement, and condensate management.

Design and functionality of external components, peripherals, and mounting solutions that enhance, protect, or integrate with mobile electronic devices, such as modular cases, docking stations, and specialized mounts.

Mechanical and thermal package design for LED modules, including heat sinks, thermal pads, flexible PCBs, and component housings for heat dissipation.

Systems and methods for dynamically adjusting light output, distribution, color, or intensity based on environmental conditions, user presence, content, or specific application needs.

Optical structures and lens designs that improve light extraction efficiency from LED dies and modules, including diffractive films, micro-lens arrays, reflectors, and color-conversion layers.

Mechanisms and control systems for precisely moving valve elements, often involving electric motors, cams, solenoids, or pneumatic/hydraulic pilots, to achieve desired flow or position.

Methods and components for converting power into mechanical motion to drive pump mechanisms, encompassing electric motors, hydraulic actuators, and specialized motion converters like ball screws or solenoids.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Focuses on the design, fabrication, and application of piezoelectric materials and devices for sensing, actuation, or wave generation, including material properties, single crystal growth, and protective layers.