FUJIFILM DIMATIX, INC.

A piezoelectric film stack is created by forming a lower electrode stack on a structured substrate. A pyrochlore lead zirconium titanate (PZT) buffer substrate layer is then formed on the lower electrode stack. A rapid thermal anneal of the PZT buffer substrate layer is then performed. Epitaxial perovskite ( 100 ) PZT film on the PZT buffer substrate layer is grown. An upper electrode stack is formed on the perovskite ( 100 ) PZT film.

A piezoelectric film stack is created by forming a lower electrode stack on a structured substrate. A pyrochlore lead zirconium titanate (PZT) buffer substrate layer is then formed on the lower electrode stack. A rapid thermal anneal of the PZT buffer substrate layer is then performed. Epitaxial perovskite (100) PZT film on the PZT buffer substrate layer is grown. An upper electrode stack is formed on the perovskite (100) PZT film.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

Apparatuses (e.g., inkjet printheads) having a dryfilm tenting structure and methods for fabricating the same are disclosed. In some embodiments, an inkjet printhead comprises a first actuator substrate having one or more cavities for fluid routing and include an actuator cavity; an actuator stack coupled to the first structure and positioned at least partially over the actuator cavity, the actuator stack comprising a membrane, an actuator coupled to a first side of the membrane, and a tented structure coupled to the actuator substrate to create an enclosed cavity large enough to enable the membrane in the cavity to bow without contacting the tented structure.

A fluid ejector includes a nozzle layer, a body, an actuator and a membrane. The body includes a pumping chamber, a return channel, and a first passage fluidically connecting the pumping chamber to an entrance of the nozzle. A second passage fluidically connects the entrance of the nozzle to the return channel. The actuator is configured to cause fluid to flow out of the pumping chamber such that actuation of the actuator causes fluid to be ejected from the nozzle. The membrane is formed across and partially blocks at least one of the first passage, the second passage or the entrance of the nozzle. The membrane has at least one hole therethrough such that in operation of the fluid ejector fluid flows through the at least one hole in the membrane.

Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

A method for ejecting fluid from a fluid ejector includes actuating a piezoelectric actuator to cause deformation of a membrane defining a wall at a first end of an elongated channel of the fluid ejector, the deformation of the membrane causing ejection of a droplet of fluid from a nozzle disposed at a second end of the channel. The elongated channel fluidically connects a first channel to the nozzle, the first channel disposed at the first end of the elongated channel, and wherein an impedance of the first channel is at least ten times greater than an impedance of the elongated channel. Deformation of the membrane induces fluid flow along the elongated channel, and wherein at least 60% of the fluid flow induced by the deformation of the membrane is in a direction extending from the first end of the elongated channel to the second end of the elongated channel.

An inkjet printer printhead, member thereof, or other component has an internal cavity that has a protective coating. Further surfaces of the component may have the protective coating. To make the protective coating, a target thickness for a film of HfO 2 (hafnia) is selected, that will avoid formation of pinholes, thin spots and nodule growth. Using atomic layer deposition (ALD), with the processing adjusted for the target thickness, the film of HfO 2 is deposited as a conformal layer on the component, including on a surface of the internal cavity, to form a coated component. A non-wetting coating can be included over the film of HfO 2 .

An inkjet printer printhead, member thereof, or other component has an internal cavity that has a protective coating. Further surfaces of the component may have the protective coating. To make the protective coating, a target thickness for a film of HfO 2 (hafnia) is selected, that will avoid formation of pinholes, thin spots and nodule growth. Using atomic layer deposition (ALD), with the processing adjusted for the target thickness, the film of HfO 2 is deposited as a conformal layer on the component, including on a surface of the internal cavity, to form a coated component. A non-wetting coating can be included over the film of HfO 2 .