FUJITSU OPTICAL COMPONENTS LIMITED

An optical device includes a photonic integrated circuit chip and a resin member. The photonic integrated circuit chip has a first surface on which an optical circuit and first electrical wiring are formed. The resin member makes contact with at least part of the photonic integrated circuit chip. A dam structure is formed along an outer circumference of the first surface. At least part of the optical circuit is formed using a different material that is different from a material of the photonic integrated circuit chip. The resin member seals the photonic integrated circuit chip without sealing an area on an inner side with respect to the dam structure of the first surface. Second electrical wiring is formed on a surface of the resin member. The second electrical wiring is electrically connected to the first electrical wiring.

An optical integrated circuit module includes an optical integrated circuit element that includes as optical waveguide that is made by using an organic electro-optical material, and a cover that seals, as vacuum sealing, at least the optical waveguide that is disposed on the optical integrated circuit element. In addition, the optical integrated circuit module includes an oxygen getter that is provided in an inner part of the cover and that absorbs oxygen contained in the inner part of the cover.

An optical integrated circuit module includes an optical integrated circuit element that includes as optical waveguide that is made by using an organic electro-optical material, and a cover that seals, as vacuum sealing, at least the optical waveguide that is disposed on the optical integrated circuit element. In addition, the optical integrated circuit module includes an oxygen getter that is provided in an inner part of the cover and that absorbs oxygen contained in the inner part of the cover.

An optical amplifier includes an optical amplifier chip that includes a pair of semiconductor optical amplifiers (SOAs), a U-shaped waveguide connecting the pair of SOAS, and two electrodes that respectively correspond to the pair of SOAS and are separated from each other, and a base substrate that includes a common metal wiring connecting the two electrodes, and on which the optical amplifier chip is mounted.

The optical module includes a housing, a lid that closes an opening of the housing, an optical component arranged inside the housing, and a printed circuit board arranged on a front surface of the lid outside the housing so as to be used as a board on which a control circuit that controls the optical component is mounted. The optical module further includes a side electrode that is provided on a side surface of the housing and configured to be electrically connected to an electrode of the optical component; and a flexible substrate that provides electrical connection between the side electrode and an electrode of the control circuit. The optical module can be miniaturized by integrating the optical component and the control circuit.

An optical module includes: a module body that is configured to be inserted into a cage, at an entrance of the cage an electromagnetic wave shielding terminal being provided, and has a groove formed on one surface thereof and configured to engage with a latch part formed on the cage; and an engagement release member including a body that is provided with a pull tab, the body being slidably attached to the module body and configured to slide in response to an external force, and an arm part that extends from the body along the groove, and slides with respect to the groove in conjunction with the sliding of the body and release the engagement in a state in which the electromagnetic wave shielding terminal is pressed. The module body has a concave part on a surface of the groove, the surface being in contact with the arm part.

An optical device includes a substrate that includes a substrate-side electrode, and a chip that includes N active layers and a chip-side electrode that is mounted on the substrate-side electrode. From among bumps that are disposed side by side with an Nth layer on both sides of a surface that is located opposite the Nth layer and that is included in the substrate-side electrode, bumps located at a position farther away from the center of gravity of all of the bumps are defined as first bumps, and bumps located at a position closer to the center of gravity are defined as second bumps. In at least one combination of the first bump and the second bump, the first bump and the second bump are arranged on the substrate-side electrode such that a distance between the first bump and the surface is longer than a distance between the second bump and the surface.

An optical module includes: a first board having an optical component bonded thereto with an adhesive; a connection structure part rising from the first board and made of a material having lower thermal conductivity than thermal conductivity of a material of the first board; and a second board joined to the connection structure part.

An optical module includes an optical semiconductor chip having a first surface that includes a laser beam irradiation region and a cleavage region, an optical fiber optically coupled to the first surface, and a support member having a second surface bonded to the first surface, and configured to support the optical fiber. The optical semiconductor chip has an optical signal input and output part located in the cleavage region, and the second surface is bonded to the first surface within the cleavage region.

An optical module includes an optical semiconductor chip including a first electrode pad, a second electrode pad, and a third electrode pad arranged between the first electrode pad and the second electrode pad, a wiring substrate on which the optical semiconductor chip is flip-chip mounted, including a fourth electrode pad, a fifth electrode pad, and a sixth electrode pad arranged between the fourth electrode pad and the fifth electrode pad, a first conductive material connecting the first electrode pad with the fourth electrode pad, a second conductive material connecting the second electrode pad with the fifth electrode pad, a third conductive material arranged between the first conductive material and the second conductive material, connecting the third electrode pad with the sixth electrode pad, and a resin provided in an area on the second conductive material side of the third conductive material between the optical semiconductor chip and the wiring substrate.