Company patents
GaN Systems Inc.
GaN Systems Inc. shows a surprising and dramatic shift in its patent strategy, with significant declines across nearly all categories in 2025 and 2026 so far, following a period of consistent patenting in 2023-2024, particularly in its core areas like Transistor & Device Structure (39.2% of portfolio) and Semiconductor Packaging & Encapsulation (31.4% of portfolio), both of which saw 100% year-over-year declines in 2025.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
51 US filings (since 2023) · 12 categories · 13 themes
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.
Systems and methods for transferring electrical energy without physical contact, often utilizing inductive or resonant coupling, including antenna design, resonance tracking, and control mechanisms for efficient power delivery.
Techniques for forming electrical contacts, vias, and interconnects to semiconductor devices, including advanced methods like contact-over-active-gate (COAG) and backside contacts for improved density and performance.
Specialized circuits and devices designed to protect electrical and electronic systems from transient overvoltages caused by electrostatic discharge (ESD) or power surges, often involving suppressor diodes, gas discharge tubes (GDTs), or voltage clamping mechanisms.
Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Technologies for efficiently delivering power to electric vehicles, encompassing fast charging, wireless charging, and smart grid integration, alongside vehicle-side control and management of the charging process.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Patents
Showing 1-6 of 6
Wireless Power Transfer Systems