Garuda Technology Co., Ltd.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.

Measures force or pressure by detecting changes in electrical capacitance. This typically involves the deformation of a dielectric material or the relative movement of conductive plates, altering the distance or area between them.

Sensors and systems designed to detect and quantify localized contact forces, pressure distribution, or touch interactions, often employed in robotics, human-machine interfaces, or object manipulation applications.

Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.

Design and integration of thermoelectric modules for converting heat into electricity (power generation) or using electricity for cooling/heating, often involving p-type/n-type semiconductor pellets and waste heat recovery.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Systems and sensors designed to measure the pressure difference between two distinct points or to capture rapid, transient pressure fluctuations in fluid or gas systems, often using diaphragms or pistons.

Mechanical structures and devices designed to support, stabilize, or mount cameras and related photographic equipment, often featuring quick-release mechanisms, damping, or adjustable components.

Utilizes optical fibers, often incorporating Fiber Bragg Gratings (FBG), to detect changes in strain, pressure, or temperature based on modifications to light signals (e.g., wavelength shifts, phase changes) transmitted through the fiber.

Sensors that quantify strain or deformation by measuring the change in electrical resistance of a material, such as a semiconductor film or conductive layers, as it undergoes mechanical stress.

Focuses on the structural integrity, housing, mounting, and physical integration of battery cells into robust and protected packs within electric vehicles, including manufacturing considerations.

Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.

Process and equipment for producing solid-state battery cells, including solid electrolyte synthesis (sulfide/oxide/polymer), thin-film deposition, lamination, sintering, dry-electrode fabrication, and stacking under controlled atmosphere.