Company patents

Heraeus Deutschland Gmbh & Co. KG

Heraeus Deutschland Gmbh & Co KG's patent strategy shows a surprising shift away from its traditionally strong areas, with significant year-over-year declines across nearly all top categories in 2025 and so far in 2026, including Alloys (-25.0% in 2025), Medical Diagnostics & Surgery (-75.0% in 2025), and Electrotherapy / Radiation Therapy (-60.0% in 2025). While there were strong growths in 2024 for categories like Electrical Connectors (+400.0%) and Welding & Soldering (+150.0%), these did not sustain into 2025, indicating a broad re-evaluation of R&D focus rather than a targeted pivot.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

92 US filings (since 2023) · 12 categories · 25 themes

Specialized Conductor Formulations

Development of new conductive materials, including powders, composites, and alloys, designed for specific electrical performance, manufacturing processes, or applications beyond basic copper wires.

Cables & Conductors
Who else files here? →
22since 2023
-81.8%YoY
Alloy Coatings & Surface Treatment

Methods and compositions for applying metallic or alloy layers to a substrate, or modifying the surface of an alloy, to impart specific functional properties such as corrosion resistance, wear resistance, electrical insulation, or improved adhesion, without altering the bulk properties significantly.

Alloys
Who else files here? →
9since 2023
-66.7%YoY
Novel Catalyst Materials

Development and synthesis of catalysts with unique compositions or structures, such as medium entropy alloys, metal foam-supported catalysts, layered catalytic articles, or high-entropy oxides, to enhance activity, selectivity, or stability in chemical reactions.

Catalysts & Reactors
Who else files here? →
8since 2023
+50.0%YoY
Electronic Component Bonding

Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.

Welding & Soldering
Who else files here? →
7since 2023
-50.0%YoY
Robust Electrical Contact Systems

Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.

Electrical Connectors
Who else files here? →
6since 2023
-66.7%YoY
Neuromodulation and Electrical Stimulation

Therapeutic application of electrical signals to nerves or tissues to modulate their activity, often using implantable devices, electrodes, and sophisticated programming for various conditions.

Electrotherapy / Radiation Therapy
Who else files here? →
5since 2023
0.0%YoY
Advanced Solder & Flux Formulations

Development of novel chemical compositions for fluxes, solders, and filler metals to improve material properties, enhance joint reliability, reduce defects, or meet specific application requirements like high-temperature reflow or specialized material joining.

Welding & Soldering
Who else files here? →
5since 2023
-33.3%YoY
Metal Matrix Composites & Hard Materials

Composite materials where a metallic matrix is reinforced with a second phase (e.g., ceramic particles, carbon nanotubes, diamond grains) to significantly enhance properties like hardness, wear resistance, stiffness, or strength, often used in cutting tools, wear parts, or structural applications.

Alloys
Who else files here? →
5since 2023
new
Cable Termination & Management

Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.

Cables & ConductorsElectrical Connectors
Who else files here? →
5since 2023
-50.0%YoY
Advanced Electronic Packaging

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
Who else files here? →
5since 2023
n/a
OLED Emitter Materials

Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.

Acyclic / Cyclic Compounds (Other Elements)
Who else files here? →
4since 2023
new
Polymerization Catalysts & Modifiers

Organometallic or organosilicon compounds used as catalysts to facilitate polymerization reactions, such as olefin metathesis, or as crosslinkers and modifiers to enhance the properties of polymer compositions like silicones.

Acyclic / Cyclic Compounds (Other Elements)
Who else files here? →
4since 2023
n/a
Metal Additive Manufacturing Processes

Techniques for building three-dimensional metal objects layer-by-layer using metal powders, including powder bed fusion, binder jetting, and directed energy deposition. This theme encompasses process mechanics, equipment design, and operational control for AM systems.

Powder Metallurgy
Who else files here? →
3since 2023
-50.0%YoY
Flexible and Printed Circuitry

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Printed Circuits & Electronic Assemblies
Who else files here? →
3since 2023
n/a
Adaptive & Wearable Bio-Stimulation

Systems that provide therapeutic stimulation or field therapy through wearable devices, often incorporating physiological sensing and closed-loop feedback for personalized and adaptive treatment.

Electrotherapy / Radiation Therapy
Who else files here? →
2since 2023
0.0%YoY
Advanced Adsorbent & Separation Media

Development of materials with tailored porosity, surface chemistry, or structure, such as metal-organic frameworks (MOFs), zeolites, or superficially porous particles, for selective adsorption, ion exchange, or chromatographic separations.

Catalysts & Reactors
Who else files here? →
1since 2023
new
Emerging Contaminant Removal

Specific techniques and materials developed to remove persistent or difficult-to-treat pollutants from water, such as per- and polyfluoroalkyl substances (PFAS), micropollutants, or specific industrial chemicals.

Catalysts & Reactors
Who else files here? →
1since 2023
new
Interventional & Implantable Therapies

Design and application of devices that are inserted into the body or implanted to treat diseases, modulate physiological functions, or repair anatomical structures.

Medical Diagnostics & Surgery
Who else files here? →
1since 2023
n/a
Advanced Magnetic Powder Materials

Development and processing of metal powders with specific magnetic properties, including soft magnetic alloys, permanent magnet materials, and insulated powders for electronic components, often involving precise control of particle size, morphology, and composition.

Powder Metallurgy
Who else files here? →
1since 2023
n/a
Reactor System Design & Optimization

Engineering approaches to improve the efficiency, control, and performance of chemical reactors, encompassing continuous processes, heat exchange integration, and specialized reactor configurations for various chemical transformations.

Catalysts & Reactors
Who else files here? →
1since 2023
n/a
Cable Harness & Armor Design

Structural design and manufacturing techniques for bundling multiple wires into harnesses, including protective layers like braiding and interlocking armor, and methods for assembly and termination.

Cables & Conductors
Who else files here? →
1since 2023
n/a
3D Die Stacking & Vertical Interconnects

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Semiconductor Packaging & Encapsulation
Who else files here? →
1since 2023
n/a
Encapsulation Materials & Processes

Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.

Semiconductor Packaging & Encapsulation
Who else files here? →
1since 2023
n/a
Electronics Encapsulation & Sealing

Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.

Semiconductor Packaging & Encapsulation
Who else files here? →
1since 2023
n/a
Device Enclosure & Material Engineering

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Printed Circuits & Electronic Assemblies
Who else files here? →
1since 2023
n/a

Patents

Showing 1-10 of 203

Page 1 of 21
US 12612679 B2GRANTED
C22B9/16

Method for breaking down a mixture of solid particles comprising ruthenium

Filed:2019-11-29Pub:2026-04-28
Applicant:Heraeus Deutschland Gmbh & Co. KG

A method for breaking down a mixture, which is present in the form of solid particles, consisting of: (A) 0 to 99% by weight of metallic ruthenium, (B) 0 to 50% by weight of at least one element other than ruthenium, which is present in elementary form, selected from the group of elements of the atomic numbers 13, 21-30, 39-42, 45-52, and 72-83, (C) 0 to 99% by weight of ruthenium oxide, (D) 0 to 70% by weight of at least one solid element oxide other than ruthenium, (E) 0 to 30% by weight of at least one inorganic substance other than (A) to (D), and (F) 0 to 3% by weight of at least one organic substance, wherein the sum of the % by weight of the compounds (A) to (F) is 100% by weight and the ruthenium content of the mixture is 2 to 99% by weight, and wherein the method comprises the steps of: (1) optionally mixing said mixture with alkali carbonate by forming a blend, (2) alkaline oxidizing breakdown of the mixture or of the blend, respectively, formed in optional step (1) into molten potassium hydroxide using a gaseous oxidizing agent selected from the group consisting of air, oxygen, and air/oxygen mixtures, and without use of nitrate, and (3) cooling down the breakdown material formed in step (2) to a temperature below its solidification temperature, wherein the gaseous oxidizing agent is introduced into the melt in step (2).