Company patents
HERRMANN ULTRASCHALLTECHNIK GMBH & CO. KG
HERRMANN ULTRASCHALLTECHNIK GMBH & CO. KG's patent strategy is heavily concentrated in manufacturing, with Plastics Shaping & Molding (62.2% of portfolio) and Welding & Soldering (35.6%) dominating, yet both categories saw significant declines in 2025 and so far in 2026 after rapid growth in 2024 (e.g., Welding & Soldering grew +300.0% YoY in 2024). A surprising, albeit small, foray into Implants & Prosthetics (2.2%) in 2025 suggests a potential, albeit nascent, diversification into medical devices, though this also saw a decline so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
45 US filings (since 2023) · 6 categories · 9 themes
Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.
Systems and methods for precisely controlling welding parameters such as power, speed, oscillation, and material feed to optimize weld quality, consistency, and efficiency, often involving automated or semi-automated processes.
Technologies and methods for securely closing, sealing, and maintaining the integrity of packages, including heat sealing, vacuum sealing, strapping, and specialized closure units, often involving material interaction and atmosphere control.
Design and features of welding and soldering tools, fixtures, and accessories that enhance user safety, ergonomics, operational efficiency, and precise workpiece manipulation, including protective equipment and clamping mechanisms.
Methods and equipment for continuously shaping plastic materials by forcing them through a die, often involving screw extruders, heating elements, and downstream calibration.
Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.
Processes involving the application of heat and pressure to shape thermoplastic or elastomeric materials, often using molds or presses, to achieve specific forms or material properties.
Systems and methods for assessing the quality and characteristics of welds or solder joints, often involving non-destructive testing (NDT) techniques, image processing, or real-time feedback for process control and defect detection.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Patents
Showing 1-10 of 61