Company patents
HIROSE ELECTRIC CO., LTD.
HIROSE ELECTRIC CO., LTD. surprisingly maintains an overwhelming focus on Electrical Connectors, representing 86.8% of its patent portfolio, despite a recent decline of 19.5% in 2025 and 15.2% so far in 2026. While core to their business, the company is also showing a notable emerging focus in Printed Circuits & Electronic Assemblies, with 4 patents so far in 2026 after a complete absence in 2023 and 2025, indicating a potential shift in R&D priorities.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
151 US filings (since 2023) · 4 categories · 10 themes
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Methods and devices that determine the position, angle, or distance of an object by detecting changes in magnetic fields or inductive coupling.
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Design techniques and components within connectors to minimize signal degradation, crosstalk, and impedance mismatches for high-frequency data transmission.
Methods and apparatus for measuring magnetic fields or utilizing magnetic resonance principles for medical diagnostics, material analysis, or precise localization, including gradient field measurement in MRI.
Patents
Showing 1-3 of 3
Semiconductor Electrical Test