HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.

An optical module including a light source having a laser assembly, the laser assembly includes a semiconductor gain chip and a wavelength tuning chip. The wavelength tuning chip includes at least one microring filter configured to filter out a beam with a specific wavelength from a beam emitted by the semiconductor gain chip. The microring filter includes a first slab region and a second slab region located on both sides of a silicon waveguide ridge region and contact electrodes. An N-type doped region is provided in the first slab region, and a P-type doped region is provided in the second slab region. The P-type doped region and N-type doped region form a PN junction electrically connected to the contact electrodes. Applying a reverse bias to the PN junction can absorb electron hole pairs in the silicon waveguide ridge region, the first slab region and the second slab region.

An optical module includes a circuit board having a notch portion and a base. The base is provided thereon with an optical emission component which includes a laser located in the notch portion and configured to output a light not carrying a signal; an optical modulation chip configured to modulate the light to obtain an optical signal; an optical fiber array coupled with the optical modulation chip for transmitting the optical signal; an optical reception component is arranged on one side of the circuit board and includes a light turning member having a reflective end face and an optical reception chip located in a reflective optical path of the reflective end face, or, the optical reception component includes a lens assembly covered on the circuit board and having a reflective surface, and an optical reception chip located in a reflective optical path of the reflective surface.

An optical module, including a lower shell provided with a support plate, an assembly mechanism and a clamping component are arranged on the support plate; the clamping component has an unlocking surface; the unlocking component includes an assembly portion and an unlocking portion, the assembly portion is movably connected with an assembly mechanism; the unlocking surface is configured to enable the unlocking portion to unlock the clamping component; a movable gap for the unlocking component to move is provided between the assembly mechanism and a support surface of the support plate; a first protruding portion is provided on one side of the assembly mechanism facing the unlocking component; and in a reset process of the unlocking component, the first protruding portion is configured to selectively abut against the unlocking component, such that the first protruding portion pushes the unlocking component to move toward the lower shell.

An optical module including a lower shell part and an unlocking component. The lower shell part includes first and second lower side plates. The unlocking component includes first and second unlocking portions; a first reed is arranged between the first unlocking portion and the first lower side plate, one end of the first reed being fixedly connected to any one of the first unlocking portion and the first lower side plate, the other end movably connected to any one of the first unlocking portion and the first lower side plate, and central area of the first reed protrudes outwardly and has an open groove; similarly, a second spring is arranged between the second unlocking portion and the second lower side plate, with one end fixedly connected and the other end movably connected, central area of the second spring is protruded outwardly and has an open groove.

An optical module includes a circuit board and a light emitting assembly. The circuit board includes a first circuit board ground line, a second circuit board ground line and a circuit board signal line. The light emitting assembly is connected to the circuit board, and the light emitting assembly includes a spacer and a laser chip. The spacer includes a first spacer ground line, a second spacer ground line and a spacer signal line. The first spacer ground line is connected to the second spacer ground line through a fourth connection line; or the first spacer ground line is connected to the second circuit board ground line through a fifth connection line; or the second spacer ground line is connected to the first circuit board ground line through a sixth connection line; or the first circuit board ground line is connected to the second circuit board ground line through a seventh connection line.

An optical module comprising upper and lower shell parts, a circuit board and an optical connection component. The cavity formed by the upper and lower shell parts has only one opening for accommodating the optical connection component and golden fingers on the circuit board. The optical connection component comprises an optical fiber fixing member, a connecting member and a ferrule assembly. The optical fiber fixing member comprises a connection part and an insertion part. An accommodation cavity for inserting the connecting member is formed inside the connection part, and a cavity communicated with the accommodation cavity is formed inside the insertion part. The ferrule assembly is inserted into the cavity via the connecting member, and the optical fiber passes through the accommodation cavity and is connected to the ferrule assembly. An avoidance gap is formed on the connecting member, through which the optical fiber ribbon is passed.

An optical module includes: a circuit board provided with optical emission and reception chips; and a lens assembly having a bottom connected to the circuit board and covering the optical emission and reception chips. The lens assembly includes a lens assembly body, first and second optical fiber adapters arranged at a first end of the lens assembly body and configured to transmit emission optical signal and reception optical signal, respectively. A distance between centers of the optical emission chip and the optical reception chip, in a direction perpendicular to an optical axis of the first optical fiber adapter and an optical axis of the second optical fiber adapter, is less than a distance between optical axes of the first optical fiber adapter and the second optical fiber adapter. The lens assembly body is formed thereon with four optical surfaces.

An optical module includes: a circuit board; an optical chip; a lens assembly covered on the optical chip, a first seal exists between the lens assembly and the circuit board, the lens assembly is provided with a wrapping cavity and is provided with a recessed optical port groove and a blocking assembly at least partially covered on the optical port groove, and the optical port groove has a reflective surface; an optical fiber holder fixedly connected to an optical fiber at one end and fixed in the wrapping cavity at the other end, a second seal is located between respective side faces of the optical fiber holder and outer side faces of three side walls of the wrapping cavity away from the circuit board, and around a side wall of the wrapping cavity close to the circuit board.

An optical module, wherein a digital signal processor is connected to a circuit board via solder balls. The circuit board includes an upper layer board, at least one thermally conductive plate and a lower layer board. A thermally conductive layer is plated on the upper layer board and contacts lower side plates of a lower shell part of the optical module. Ground solder balls at an edge of the digital signal processor are connected to the thermally conductive layer. A thermally conductive connecting block is disposed in the upper layer board. Ground solder balls at an inner side of the digital signal processor are connected to the ground solder balls through the thermally conductive connecting block. A thermally conductive via hole is provided between the upper layer board and the thermally conductive plate to transfer heat from the digital signal processor to the thermally conductive plate.

An optical module includes a circuit board, an internal optical fiber, a first light transceiver component, a second light transceiver component, and a protective cover. The internal optical fiber includes a first optical fiber strip and a second optical fiber strip. The protective cover includes a first protective sub-cover and a second protective sub-cover. The first protective sub-cover covers the first light transceiver component and includes a first body, two rods, and two limiting structures. The two limiting structures are disposed on the two rods and configured to limit the first optical fiber strip and the second optical fiber strip. The second protective sub-cover covers the second light transceiver component and is connected to the first protective sub-cover. The second protective sub-cover is located between the two rods.