HISENSE LASER DISPLAY CO., LTD

A laser device and a laser projection apparatus are provided. The laser device includes a bottom plate, a frame body, a heat sink and a light-emitting chip. The light-emitting chip is located on a surface of the heat sink away from the bottom plate. The light-emitting chip includes a first electrode, a light-emitting layer and a second electrode that are sequentially stacked in a direction away from the bottom plate. The light-emitting layer includes a plurality of micro-particles being a plurality of protrusions and/or a plurality of depressions, and the plurality of protrusions and/or the plurality of depressions are located on a surface of the light-emitting layer proximate to the bottom plate. The heat sink includes a heat dissipation substrate, a conductive layer and a solder layer sequentially stacked in the direction away from the bottom plate, and the solder layer is configured to solder the light-emitting chip.

The present application provides a light source system and a laser projection device. The light source system comprises a display control circuit, a laser drive chip and a laser device module. The laser device module comprises at least one laser device. A drive signal output end of the display control circuit is connected to a drive signal receiving end of the laser drive chip. An enable signal output end of the display control circuit is connected to an enable signal receiving end of the laser drive chip. A drive current output end of the laser drive chip is connected to the laser device. The light source system can reduce the number of devices needing to be deployed in the light source system and can reduce a space occupied by the light source system, thereby improving the miniaturization and integration of the light source system.

A laser is provided, which includes a frame, a substrate, heat sinks, light-emitting chips, and protective devices. The frame and the heat sinks are fixed to the substrate. The heat sinks, the light-emitting chips, and the protective devices are located inside the frame. The light-emitting chips and the protective devices are fixed to the heat sinks, and the light-emitting chip and the corresponding protective device have a spacing therebetween in a length direction of the heat sink.

A laser device is provided. The laser device includes a case, a plurality of light-emitting assemblies, an upper cover assembly and a stress-offsetting structure. The case includes a bottom plate and a frame body. The frame body is disposed on the bottom plate, and is enclosed on the bottom plate to form an accommodating space with an opening. The plurality of light-emitting assemblies is located in the accommodating space and are disposed on the bottom plate. The upper cover assembly is fixed to the case and covers the opening. The stress-offsetting structure is disposed in the frame body and/or in the upper cover assembly, and is configured to be contracted in a squeezing direction when the stress-offsetting structure is squeezed.

A laser device includes a substrate, a first frame, at least one packaging structure, at least one light-emitting chip, a target optical element and a first cover. The first frame is fixed to the substrate to define a first accommodating space. The packaging structure is located in the first accommodating space and forms a second accommodating space. The light-emitting chip is located in the second accommodating space and configured to emit laser beams. The target optical element is located in the first accommodating space. The first cover is fixed to a side of the first frame away from the substrate. The packaging structure includes a target side wall, located on a light exit side of the light-emitting chip and the target side wall is light-transmissive. The laser beams emitted from the light-emitting chip is transmitted to the target optical element through the target side wall.

A laser projection apparatus includes a laser source, a light modulating engine and a projection lens. The laser source includes a laser device, a combining component, a first lens and a phosphor wheel. The combining component includes a reflecting region and two transmitting regions. The reflecting region is configured to reflect a laser beam and a fluorescent beam incident on the reflecting region. The two transmitting regions are disposed on two sides of the reflecting region respectively, and the transmitting regions are configured to transmit a plurality of laser beams emitted by the laser device. The phosphor wheel includes a first region and a second region. The first region is configured to diffuse and reflect the laser beams incident on the first region. The second region is configured to be excited to emit a fluorescent beam due to irradiation of the laser beams incident on the second region.

A laser source assembly is provided. The laser source assembly includes a plurality of lasers, a light combining assembly, a fly-eye lens and a diffusion assembly. The plurality of lasers are configured to emit laser beams. The light combining assembly is disposed on a light exit side of the plurality of lasers, and is configured to combine the laser beams. The fly-eye lens is disposed on a light exit side of the light combining assembly, and is configured to homogenize the laser beams. The fly-eye lens includes a plurality of first microlenses arranged in an array. The diffusion assembly is located between the light combining assembly and the fly-eye lens, and the diffusion assembly is movable.

A laser source includes a light-emitting assembly, a converging lens group, a phosphor wheel and a combining component. The light-emitting assembly is configured to emit a laser beam. The converging lens group is configured to converge the laser beam emitted by the light-emitting assembly. The phosphor wheel includes a fluorescence-exciting region and a laser-reflecting region. The fluorescence-exciting region is configured to generate a fluorescence beam with a color different from the converged laser beam under an excitation of the laser beam. The laser-reflecting region is configured to reflect the converged laser beam to the converging lens group. The combining component is disposed between the light-emitting assembly and the converging lens group. The combining component is configured to reflect the fluorescence beam excited by the phosphor wheel and the laser beam reflected by the phosphor wheel to a beam outlet of the laser source.

A laser source assembly is provided. The laser source assembly includes a plurality of lasers, a light combining assembly and a fly-eye lens. The fly-eye lens is disposed on a light exit side of the light combining assembly, and is configured to homogenize laser beams. The fly-eye lens includes a plurality of first microlenses located on a light incident surface thereof and a plurality of second microlenses located on a light exit surface thereof. A sine value of a divergence angle of a laser beam in a fast axis direction is greater than a sine value of an aperture angle of a first microlens in a slow axis direction, and a sine value of a divergence angle of the laser beam in the slow axis direction is greater than a sine value of an aperture angle of the first microlens in the fast axis direction.

A laser source and a laser projection apparatus are provided. The laser source includes a laser assembly. The laser assembly includes a mounting substrate, a light-emitting group, and a conductive connecting portion. The mounting substrate is a first printed circuit board and includes a first surface, a first region, and a second region. The first region and the second region are discontinuously distributed, and the first region is connected with the second region through an internal wiring of the mounting substrate. The light-emitting group is electrically connected with the first region. A first end of the conductive connecting portion is connected with the second region, and a second end of the conductive connecting portion is configured to be electrically connected with a second printed circuit board, so as to electrically connect the light-emitting group with the second printed circuit board.