Company patents
Hitachi Energy Switzerland AG
Hitachi Energy Switzerland AG's patent strategy shows a surprising and dramatic shift away from core electronics and power technologies, with categories like Magnets & Inductors, Switches, and Electrical Measurement experiencing severe declines of -80.0%, -92.3%, and -82.6% respectively in 2024, and a complete cessation of patenting in 2025 across almost all categories. The near-total absence of new patents in 2025 and so far in 2026, with only one patent each in Semiconductor Packaging & Encapsulation and Printed Circuits & Electronic Assemblies, suggests a significant re-evaluation or pause in their patenting activities, rather than a mere shift in focus.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
202 US filings (since 2023) · 12 categories · 35 themes
Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.
Integration of power converters with energy storage devices (batteries, supercapacitors) or grid interfaces, often involving AC/DC conversion, power flow management, and fault handling for hybrid power systems or specific applications like EVs or PV.
Devices and systems designed to protect electrical circuits from overcurrents, short circuits, and other faults, often involving rapid response, high voltage/current handling, and sophisticated interruption mechanisms.
Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.
Techniques and circuits for accurately identifying various electrical faults, such as ground faults, overcurrent, short circuits, switch malfunctions, or electrostatic discharge (ESD) events, often utilizing sensors, signal processing, and diagnostic algorithms.
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Methods and systems for identifying anomalies, failures, or impending issues within electric motors or their associated drive and power management circuits, often by monitoring electrical or operational parameters.
Intelligent control systems that manage the connection and disconnection of power, including pre-charging capacitive loads, reclosing after faults, or isolating parts of a grid based on detected conditions, often involving smart switches and relays with adaptive logic.
Methods and structures employed within switches and circuit breakers to safely and efficiently quench electrical arcs generated during contact separation, preventing damage and ensuring reliable interruption.
Mechanical, electromagnetic, or hydraulic systems used to physically operate the contacts of a switch or circuit breaker, focusing on the linkages, motors, coils, or fluid dynamics involved.
Circuit breaker designs that combine mechanical switches with power semiconductors or solely use solid-state components to achieve faster fault interruption, current limiting, and arc suppression in AC or DC power systems.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Design and control of power supply architectures that combine multiple power sources (e.g., AC grid, DC battery, generators) or modular battery units, often featuring switching, conversion, and redundancy for enhanced reliability and flexibility.
Switches designed for specific applications within larger systems (e.g., automotive, IoT, industrial control), often incorporating sensors, control logic, wireless communication, or specialized mechanical interfaces.
Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.
Control systems designed to monitor, optimize, and manage energy generation, storage, distribution, and consumption within industrial facilities or interconnected power networks to improve efficiency and meet regulatory requirements.
Utilizing sensor data, historical performance, and analytical models to anticipate equipment failures, diagnose faults, and estimate remaining useful life, thereby enabling proactive maintenance and reducing downtime.
Devices and methods for accurately measuring or monitoring electrical current draw and power usage in various systems, often for control, optimization, or safety purposes.
Technologies for efficiently delivering power to electric vehicles, encompassing fast charging, wireless charging, and smart grid integration, alongside vehicle-side control and management of the charging process.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Techniques for forming electrical contacts, vias, and interconnects to semiconductor devices, including advanced methods like contact-over-active-gate (COAG) and backside contacts for improved density and performance.
Development of polymer compositions and material structures for electrical insulation and protective sheathing of cables, focusing on properties like flame retardancy, flexibility, and semiconductivity.
Systems and methods for transferring electrical energy without physical contact, often utilizing inductive or resonant coupling, including antenna design, resonance tracking, and control mechanisms for efficient power delivery.
Development of new conductive materials, including powders, composites, and alloys, designed for specific electrical performance, manufacturing processes, or applications beyond basic copper wires.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.
Specialized circuits and devices designed to protect electrical and electronic systems from transient overvoltages caused by electrostatic discharge (ESD) or power surges, often involving suppressor diodes, gas discharge tubes (GDTs), or voltage clamping mechanisms.
Applying machine learning and artificial intelligence models to analyze industrial data, predict system behavior, and optimize control strategies for improved efficiency, quality, or environmental compliance in manufacturing and operations.
Systems and devices that utilize controlled magnetic fields, often generated by electromagnets, to produce mechanical motion, precise positioning, or manipulate physical phenomena like plasma distribution.
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Systems that incorporate solar panels as a primary or auxiliary power source for various applications, including visual displays, remote devices, and portable battery charging, often emphasizing efficiency and adaptability.
Design and operation of transistors optimized for memory applications, including floating body devices, ferroelectric FETs (FeFETs), vertical TFTs for 3D arrays, and charge-trapping memory cells.
Structural design and manufacturing techniques for bundling multiple wires into harnesses, including protective layers like braiding and interlocking armor, and methods for assembly and termination.
Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.
Patents
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