Company patents
Hoffman Enclosures Inc.
Hoffman Enclosures Inc. demonstrates a strong and growing focus on Printed Circuits & Electronic Assemblies, which constitutes 57.3% of its portfolio and has seen a 30.0% YoY growth so far in 2026, indicating a strategic commitment to semiconductor-related innovations. While maintaining this core, the company also shows an emerging interest in Separation Processes (Filtration, Distillation), with a significant 100.0% YoY growth in 2026, suggesting a diversification into materials technology.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
75 US filings (since 2023) · 12 categories · 12 themes
Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.
Mechanical structures and components for securely attaching photovoltaic modules to various surfaces (ground, roof, canopy) while allowing for adjustment, sealing, and integration with cleaning or support features.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Locking mechanisms specifically designed for automotive applications, recreational vehicles, or unique door types like bi-fold, sliding, or container doors, often incorporating specific safety, noise reduction, or operational features.
Furniture designs that incorporate specialized compartments, locking mechanisms, or automated retrieval systems to secure, organize, or control access to stored items within cabinets, desks, or appliances.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Systems designed for rapid and secure attachment and detachment of devices or components to a main support structure, often employing snap-fit, clamping, or magnetic mechanisms for convenience and flexibility.
Locks integrating electronic components for remote control, wireless communication, internet connectivity, and digital credential management, often including features for user identification and access monitoring.
Design and control strategies for improving the efficiency, stability, and operational flexibility of refrigerant circuits, including component integration, flow management, phase separation, and pressure regulation.
Intelligent control systems that manage the connection and disconnection of power, including pre-charging capacitive loads, reclosing after faults, or isolating parts of a grid based on detected conditions, often involving smart switches and relays with adaptive logic.
Equipment and processes for separating solid particles from liquid or gas phases in industrial settings, encompassing mechanical screening, filtration of molten materials, and various filter media designs.
Membrane and depth filtration for industrial separation, gas purification, and bioprocess clarification including cross-flow, dead-end, tangential flow filtration, and oil/water separation.
Patents
Showing 1-7 of 7
Advanced Electronic Packaging