Company patents
HORIBA STEC, Co., Ltd.
HORIBA STEC CO., LTD. demonstrates a strong and consistent focus on core manufacturing technologies, with Industrial & Autonomous Control representing 35.2% of its portfolio and Flow / Volume Measurement and Valves each accounting for 26.2%. While patenting in Semiconductor Manufacturing Process saw a significant surge of +125.0% in 2025, it's surprising to note a complete absence of new patents in this area so far in 2026, alongside a -100.0% decline in Machine Learning & AI patents from 2023 to 2024, indicating a potential shift away from these advanced computing applications.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
122 US filings (since 2023) · 11 categories · 20 themes
Incorporating sensors and processing capabilities directly into valve systems to monitor operational state, detect malfunctions, measure flow parameters, or verify proper installation.
Innovations in the construction, integration, and operational verification of flow measurement devices, including methods for calibration, fault detection, and structural integrity monitoring.
Mechanisms and control systems for precisely moving valve elements, often involving electric motors, cams, solenoids, or pneumatic/hydraulic pilots, to achieve desired flow or position.
Valves specifically designed for managing fluid power in hydraulic or pneumatic systems, including components for pressure regulation, flow direction, and system centering.
Technologies for measuring the flow rate, level, or composition of mixtures containing multiple fluid phases (e.g., liquid-liquid, liquid-gas, liquid-solid suspensions), often employing specialized sensing principles to differentiate components.
Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.
Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.
Specialized valve designs for domestic and commercial applications involving water distribution, temperature control, and air conditioning, often focusing on integration, materials, and specific flow characteristics.
Methods and systems for real-time monitoring and control of coating processes or chamber cleaning, utilizing sensor data (e.g., thermal, pressure, optical) and predictive models to ensure quality and optimize efficiency.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Mixing apparatus designed for integration directly into a fluid conduit or a continuous process stream, often employing static elements, impellers within a flow path, or multi-component injection for efficient, uninterrupted processing.
Design and engineering of specialized components within deposition systems, such as heaters, targets, susceptors, and chamber walls, to achieve precise control over process parameters like temperature, material flux, and plasma characteristics.
Integration of heating, cooling, or temperature regulation mechanisms within mixing devices or vessels to maintain specific process temperatures, prevent overheating, or induce thermally-driven reactions.
Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.
Equipment and techniques specifically designed for effectively mixing and agitating high-viscosity fluids, slurries, or suspensions, often found in industrial, chemical, or battery manufacturing processes where material flow is challenging.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Valves engineered to automatically open or close based on pressure differentials, preventing over-pressurization, controlling flow direction, or suppressing backflow in fluid systems.
Techniques utilizing various physical principles (e.g., radar, capacitance, ultrasound, thermal, optical, force) to accurately determine the fill level or presence of substances in containers, often under challenging conditions.
Patents
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