Company patents
Hutchinson Technology Incorporated
Hutchinson Technology Incorporated shows a surprising shift in its patent strategy, with its two largest categories, Optical Elements & Systems (40.8% of portfolio) and Photographic Apparatus (36.6% of portfolio), both experiencing significant declines in 2025 (YoY -41.7% and -50.0% respectively) and so far in 2026, suggesting a potential re-evaluation of focus despite strong growth in 2024.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
71 US filings (since 2023) · 11 categories · 16 themes
Mechanisms and control systems for precise movement of optical lens elements, often for autofocus, zoom, or image stabilization, utilizing various driving principles (e.g., piezoelectric) and low-friction components.
Mechanisms allowing for changes in the length, height, angle, or position of a support frame or component, often using sliding, rotating, or telescoping elements to achieve desired configurations.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Mechanical structures and devices designed to support, stabilize, or mount cameras and related photographic equipment, often featuring quick-release mechanisms, damping, or adjustable components.
Measures force or pressure by detecting changes in electrical capacitance. This typically involves the deformation of a dielectric material or the relative movement of conductive plates, altering the distance or area between them.
Sensors and systems designed to detect and quantify localized contact forces, pressure distribution, or touch interactions, often employed in robotics, human-machine interfaces, or object manipulation applications.
Techniques for building three-dimensional metal objects layer-by-layer using metal powders, including powder bed fusion, binder jetting, and directed energy deposition. This theme encompasses process mechanics, equipment design, and operational control for AM systems.
Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Support structures and stands specifically engineered for electronic devices such as displays, tablets, cameras, or handheld devices, often incorporating features for viewing angle adjustment, stability, or power/data integration.
Camera assemblies specifically designed for integration into vehicles, addressing challenges like mounting, field of view coverage, environmental robustness, and specialized imaging (e.g., near-infrared) for autonomous driving or safety.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Development of novel material compositions, thin-film deposition techniques, and surface treatments for recording layers, lubricants, and protective coatings to improve data density, durability, and magnetic or optical properties.
Systems and sensors designed to measure the pressure difference between two distinct points or to capture rapid, transient pressure fluctuations in fluid or gas systems, often using diaphragms or pistons.
The integration of force, strain, or temperature sensors directly into large-scale structures or components (e.g., concrete, pavement, pipelines) to enable real-time health assessment, anomaly detection, and long-term performance monitoring.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Patents
Showing 1-10 of 132