Company patents
Infineon Technologies Americas Corp.
Infineon Technologies Americas Corp. shows a surprising shift in its patent strategy, with a significant portion of its portfolio (over 40% across multiple categories) emerging so far in 2026, including 6 patents in Power Conversion (DC/AC, DC/DC) and 6 in Pulse / Digital Logic Circuits, after several years of zero or declining activity in these areas. This suggests a renewed or accelerated focus on core semiconductor and power technologies, alongside new interests in Wireless Networks (5 patents) and Computer Hardware Architecture (5 patents) also appearing exclusively in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
71 US filings (since 2023) · 12 categories · 20 themes
Techniques for efficiently supplying power to electronic devices, managing battery charge/discharge cycles, optimizing power consumption, and converting power between different voltage levels or AC/DC for improved energy efficiency and longevity.
Technologies for establishing and managing high-bandwidth, low-latency communication pathways between computing components, peripherals, or systems, focusing on signal integrity, synchronization, and interface standards.
Techniques and hardware architectures for optimizing the radio frequency (RF) front-end, antenna systems, and beamforming strategies in wireless networks to improve signal quality, capacity, and interference mitigation.
Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.
Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.
Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.
Enhancements to the physical and data link layers of network communication, focusing on hardware components, signal integrity, power efficiency, and efficient data transfer mechanisms for specific interfaces and buses.
Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.
Focuses on the architectural and circuit-level innovations for Analog-to-Digital Converters (ADCs) and Digital-to-Analog Converters (DACs) to improve speed, accuracy, linearity, and power efficiency. Includes specific types like SAR and Delta-Sigma, and their constituent components.
Techniques and circuits designed to identify, compensate for, or correct non-linearities, offsets, and other imperfections in signal processing paths, particularly within analog-to-digital, digital-to-analog, or digital-to-time converters.
Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.
Systems enabling wireless communication between vehicles (V2V), vehicles and infrastructure (V2I), or vehicles and other entities (V2X) to share information for traffic management, safety, and navigation.
Methods and architectures for processing digital signals to enhance quality, remove noise, manage group delay, and facilitate symbol decision, often involving digital filters and equalization techniques.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Incorporation of novel semiconductor, dielectric, or metallic materials into transistor structures to achieve enhanced performance, new functionalities, or specific device characteristics.
Integration of power converters with energy storage devices (batteries, supercapacitors) or grid interfaces, often involving AC/DC conversion, power flow management, and fault handling for hybrid power systems or specific applications like EVs or PV.
Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.
Methods and systems for efficiently reducing the size of digital data, often employing adaptive techniques, neural networks, or temporal modeling, to achieve high compression ratios while preserving data quality. Includes entropy coding.
Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.
Patents
Showing 1-10 of 284