InnoLight Technology (Suzhou) Ltd.

An active optical cable, comprising an optical cable assembly ( 10 ) and an optical module ( 20 ). The optical cable assembly ( 10 ) comprises a first insertion core ( 11 ), the optical module ( 20 ) comprises a second insertion core ( 221 ), and the first insertion core ( 11 ) and the second insertion core ( 221 ) are joined in an insertion cavity ( 31 ) of an adapter ( 30 ), so as to achieve optical signal interaction between the optical cable assembly ( 10 ) and the optical module ( 20 ). The adapter ( 30 ) further has a first adjustment structure ( 32 ), a housing further has a second adjustment structure ( 212 ), and the first adjustment structure ( 32 ) and the second adjustment structure ( 212 ) are used for acting in concert to adjust the position of the adapter ( 30 ) in a mounting cavity ( 211 ), so as to adjust the bending of a connecting optical fiber ( 222 ). Adjusting the position of the adapter ( 30 ) so as to adjust the connecting optical fiber ( 222 ) to be in a relatively relaxed state avoids too small of a bending radius of the connecting optical fiber ( 222 ) due to excessive bending of the connecting optical fiber ( 222 ), and ensures an optical signal transmission effect.

A flexible circuit board, a light receiving/transmitting assembly, an optical module, and a connection method. The flexible circuit board includes a top metal layer having a high-speed signal line formed therein, a substrate, and a bottom metal layer having a ground zone formed therein which are sequentially stacked in a thickness direction. The high-speed signal line has a high-speed-signal via a pad located at one end of the flexible circuit board and electrically connected to an external high-speed pin. The top metal layer has an auxiliary ground reference formed therein. The auxiliary ground reference is disposed neighboring the high-speed signal line and stacked with the ground zone. The auxiliary ground reference is electrically connected to the ground zone by means of an auxiliary conductive hole, and the auxiliary ground reference and/or the ground zone is provided with a ground via pad electrically connected to an external ground pin.

Provided are a silicon-based tunable filter, laser and an optical module. The tunable laser comprises a semiconductor optical amplifier and a silicon photonic integrated chip, wherein a first coupler, a phase regulator and a tunable filter are provided on the silicon photonic integrated chip; the tunable filter comprises a flat-top band-pass filter structure, a Mach-Zehnder interferometry (MZI) structure and a micro ring resonation (MRR) structure, which are cascaded; gain light emitted by the semiconductor optical amplifier is coupled to the silicon photonic integrated chip by means of the first coupler, and a narrowband filtered optical signal is output by means of the tunable filter; and the phase of the gain light is regulated by means of the phase regulator so as to output single-peak narrowband laser light with a tunable target wavelength.

The present application relates to a filter implementation method and apparatus, a noise suppression method and apparatus, and a computer device, a storage medium and a computer program product. The filter implementation method comprises: acquiring a first signal frequency spectrum and a first power spectrum, which correspond to a first test signal; determining a noise spectrum of the first test signal according to the first signal frequency spectrum and the first power spectrum; then acquiring a second signal frequency spectrum corresponding to a second test signal; and determining a frequency response of a Wiener filter according to the second signal frequency spectrum and the noise spectrum of the first test signal. By means of the filter implementation method in combination with a frequency domain method, a frequency response of a Wiener filter under MPI noise can be obtained, such that an optimal filter for the MPI noise can be achieved, and the MPI noise can be suppressed to the greatest extent, thereby preventing the transmission of a PAM signal from being impacted by the MPI noise.

A heat dissipation structure of an optical module. A heat dissipation layer ( 200 ) is arranged on a bottom plate ( 110 ) of a base ( 100 ). Pressing parts ( 121 ) are arranged on two sides in the width direction of the bottom plate ( 110 ). A heat dissipation module ( 300 ) is used to press down to apply an acting force to the heat dissipation layer ( 200 ), such that a first plate body ( 310 ) of the heat dissipation module ( 300 ) presses the heat dissipation layer ( 200 ) to deform. The pressing parts ( 121 ) are closely fitted to the first plate body ( 310 ) by using the springback property of the heat dissipation layer ( 200 ). The pressing parts ( 121 ) tightly press a limiting part ( 3101 ) of the first plate body ( 310 ) to prevent the heat dissipation module ( 300 ) from moving in an accommodation cavity ( 130 ), thereby ensuring the assembly stability. The heat dissipation layer ( 200 ) can absorb flatness and deformation degree tolerances of the first plate body ( 310 ) and the bottom plate ( 110 ), such that interface thermal resistance can be reduced, thereby ensuring the heat dissipation performance. In addition, due to springback of the heat dissipation layer ( 200 ), the first plate body ( 310 ) is closely fitted to the pressing parts ( 121 ), such that the strength of connection between the heat dissipation module ( 300 ) and the base ( 100 ) is further enhanced.

A multi-channel light receiving/transmitting assembly and an optical module. The multi-channel light receiving/transmitting assembly comprises a base ( 310 ), a conductive substrate, a light transmitting assembly, and a light receiving assembly; the conductive substrate is at least partially connected with the base ( 310 ); the light transmitting assembly is used for transmitting an optical signal, and the light transmitting assembly comprises at least two laser chips ( 510 ), wherein the laser chips ( 510 ) are arranged on the base ( 310 ) in parallel in a first direction (X) and are respectively electrically connected with the conductive substrate; the light receiving assembly is used for receiving an externally inputted optical signal, and the light receiving assembly comprises at least two light receiving chips ( 610 ), wherein the light receiving chips ( 610 ) are arranged on the conductive substrate in parallel in the first direction (X) and are respectively electrically connected with the conductive substrate; the light transmitting assembly and the light receiving assembly are staggered in a second direction (Y), the second direction (Y) is perpendicular to the first direction (X), and the second direction (Y) and the first direction (X) are both parallel to the upper surface of the base ( 310 ), so as to solve the technical problem of difficulty in expanding more channels due to the fact that a device of a traditional light transmitting assembly occupies a relatively large space.

An optical module package structure, comprising a housing, and a circuit board, a first device, and a sub-board that are packaged in the housing. The housing comprises a first housing and a second housing. An outer surface of the first housing is a main heat-dissipation surface. The first device is electrically connected to the circuit board by means of the sub-board. A first signal line is provided on the circuit board. An extension section is provided on the sub-board. The sub-board partially overlaps the circuit board, and is connected to same. The first signal line extends to the extension section. The surfaces of the sub-board and the circuit board, partially overlapping each other, face opposite directions. The first device is electrically connected to the extension section. The first device is provided with a heat-dissipation surface. The heat-dissipation surface faces the first housing, and is thermally connected to same.

An optical circulator includes a first polarization beam splitter member having a common optical port, a second polarization beam splitter member having an emittance optical port and at least two receiving optical ports, and a first polarization adjustment member. The two receiving optical ports respectively receive two linearly polarized light beams. The two linearly polarized light beams respectively pass through the second polarization beam splitter member, and sequentially pass through the first polarization adjustment member and the first polarization beam splitter member to be combined into a first combined light beam for being output from the common optical port. The common optical port receives a compound optical signal that passes through the first polarization beam splitter member to be split into another two linearly polarized light beams that are combined into a second combined light beam for being output.

An optical module includes a housing, an optical interface and an electrical interface being formed at two opposite ends of the housing along a lengthwise direction, respectively; a heat dissipation fin, disposed at the end of the housing close to the optical interface; and a pull ring assembly, comprising a ring arm and a connecting arm connected to each other, the ring arm and the connecting arm being located at different sides of the housing, respectively, and the connecting arm covering a side of the heat dissipation fin facing away from the housing.

An optical splitter device, an optical chip, and an optical communication module. The optical splitter device is used to provide a multi-path light source for a multi-path parallel system, and comprises multiple edge coupling structures. A mode field formed by joint action of first ends of the edge coupling structures matches an optical fiber mode field, such that incident light transmitted by optical fiber is split into multiple light sources. A second end of each edge coupling structure is used to connect to the multi-path parallel system, thereby providing light sources for the multi-path parallel system. When light is split by the optical chip, limitations in operating wavelength range and excess loss caused by using a conventional optical splitter can be effectively avoided.