InnoLux Corporation

Techniques and structural designs for fabricating the physical layers of an OLED display, including material deposition, patterning, and methods to protect the active organic layers from environmental degradation like moisture and oxygen.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Innovations in backlight units, optical films, and light management structures to enhance display performance, uniformity, viewing experience, or specific functionalities like touch.

Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.

Techniques for driving electrophoretic displays, including managing remnant voltage, optimizing particle movement, and specific addressing pulse schemes to improve optical quality and update speed.

Methods and structures for mass-producing and assembling arrays of micro-LEDs onto a substrate, including transfer processes, bonding techniques, and defect management.

Physical layout and material composition of individual pixels within a display panel, including active layers, electrodes, light-emitting elements (LEDs, OLEDs), and associated thin-film transistors (TFTs).

Methods and structures for incorporating touch sensing capabilities directly into OLED display panels, typically involving conductive layers and insulating layers within or on top of the display stack.

Systems that combine light sources, waveguides, and display elements into unified products for backlighting, automotive applications, general lighting, or color-corrected displays.

Design and implementation of circuits and layouts for driving individual pixels or rows/columns of pixels, including gate drivers, data drivers, pixel driving circuits, and their integration onto the display substrate, often in non-display regions.

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Algorithms and hardware implementations within display drivers or associated components to enhance visual quality, resolution, or color reproduction, including upscaling, dithering, and compensation for display artifacts like crosstalk.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Techniques and circuits for optimizing power consumption, voltage stability, and energy efficiency in display panels, often involving dynamic voltage scaling, duty cycle control, or remnant voltage management.

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Components and techniques aimed at improving the visual quality of OLED displays, such as color accuracy, contrast, brightness uniformity, and reducing reflections or glare through optical layers and coatings.

Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.

Methods and circuits for coordinating the timing of display signals, data transmission, and control signals across various display components, ensuring proper image rendering and efficient operation.

Development and optimization of the semiconductor material layers and their interfaces within an LED to control light emission properties, manage internal stress, and improve device efficiency.

Techniques for designing and fabricating the conductive pathways (interconnects) and their contacts between different components within an integrated circuit, focusing on density, reliability, and performance.

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Optical and pixel-defining materials for display panels, including black matrix compositions, color filter pigments, optical alignment films, and pixel-define layers.

Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.

Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Layout, material composition, and structural arrangement of photoelectric conversion elements and associated circuitry within image sensor arrays, including infrared detectors and back-side illuminated structures.

Development and optimization of organic chemical compounds and their structures, including guest-host systems and metal complexes, used within the emission layer to achieve specific light emission characteristics such as color, efficiency, and operational lifetime.

Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Designing user interfaces and interaction methods specifically for mobile or wearable devices, enabling control of external systems, monitoring user states, or facilitating real-world transactions.

Methods and systems for displaying complex data in three-dimensional graphical formats, allowing users to manipulate, explore, and derive insights from the data through interactive controls.

The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.

Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.