JADE BIRD DISPLAY (SHANGHAI) LIMITED

A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, and the multiple micro-LEDs sharing the light emitting layer. The micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs.

A micro LED array includes a first type epitaxial layer; a light emitting layer continuously formed on a top surface of the first type epitaxial layer; a second type epitaxial layer formed on a top surface of the light emitting layer; and a top contact formed on a top of the second type epitaxial layer, the top contact having a circular structure or a spiral structure.

A micro LED structure includes a micro mesa comprising a bottom electrode, a PN junction structure, and a top electrode from bottom to top; and a micro lens formed on the micro mesa, wherein a top surface of the micro lens comprises a sub-micro lens array comprising a plurality of sub-micro lenses.

A micro LED array includes a first type epitaxial layer formed including: an upper continuous layer; a bottom mesa array comprising a plurality of bottom mesas, wherein the bottom mesa array is formed at a bottom of the upper continuous layer and extends down from the upper continuous layer; and a trench formed between adjacent ones of the bottom mesas; a bottom dielectric layer formed at a bottom of the bottom mesa and filled in the trench, comprising a plurality of metal vias, wherein one of the plurality of metal vias corresponds to a bottom of one of the bottom mesas; a bottom via array comprising a plurality of bottom vias formed at bottoms of the bottom mesa array and in the bottom dielectric layer, one of the bottom vias corresponding to one of the bottom mesas; a bottom reflective layer formed under the bottom mesa, filled in the trench, and around the bottom via, wherein the bottom reflective layer is provided in the bottom dielectric layer; a light emitting layer formed on a top surface of the first type epitaxial layer; and a second type epitaxial layer formed on a top surface of the light emitting layer.

A micro LED array includes a first type epitaxial layer including a first upper continuous layer; a first bottom mesa array comprising a plurality of first bottom mesas, wherein the first bottom mesa array is formed at a bottom of the first upper continuous layer and extends down from the first upper continuous layer; and a first trench formed between adjacent ones of the first bottom mesas; a light emitting layer continuously formed on a top surface of the first type epitaxial layer; and a second type epitaxial layer formed on a top surface of the light emitting layer, comprising: a second bottom continuous layer; a second upper mesa array comprising a plurality of second upper mesas extending up from the second bottom continuous layer; and a second trench formed between adjacent ones of the second upper mesas.

A micro LED array includes a first type epitaxial layer including: an upper continuous layer; a bottom mesa array comprising a plurality of bottom mesas; and a trench formed between adjacent ones of the bottom mesas; a bottom dielectric layer formed at a bottom of the bottom mesa and filled in the trench, comprising an opening array comprising a plurality of openings; a bottom via array comprising a plurality of bottom vias, formed at a bottom of the bottom mesa array and in the bottom dielectric layer; a bottom reflective layer formed under the bottom mesa and around the bottom via, wherein the bottom reflective layer is provided in the bottom dielectric layer; a light emitting layer formed on a top surface of the first type epitaxial layer; and a second type epitaxial layer formed on a top surface of the light emitting layer.

A micro LED array includes a first type epitaxial layer including: a first upper continuous layer; a first bottom mesa array comprising a plurality of first bottom mesas; and a bottom dielectric layer formed at a bottom of the first bottom mesa array and filled in a first trench; a bottom via array comprising a plurality of bottom vias formed at a bottom of the first bottom mesa array and in the bottom dielectric layer; a bottom reflective layer formed under the first bottom mesa, filled in the first trench and around the bottom via; a light emitting layer formed on a top surface of the first type epitaxial layer; and a second type epitaxial layer formed on a top surface of the light emitting layer.

A micro LED array includes: a first type epitaxial layer; a light emitting layer continuously formed on a top surface of the first type epitaxial layer; and a second type epitaxial layer formed on a top surface of the light emitting layer comprising: a bottom continuous layer formed on the light emitting layer; an upper mesa array comprising a plurality of upper mesas extending up from the bottom continuous layer, wherein the upper mesa comprises a plurality of projections and a plurality of sunken portions; and a trench formed between adjacent ones of the upper mesas.

A full color micro LED structure is disclosed. The micro LED structure comprises an IC back plane, at least three mesa structures stacked along a vertical axis, and a final conductive layer formed above the at least three mesa structures. The layers may have cut-outs to accommodate vias so that the structure may have a small footprint. Multiple micro LED structures may create an array by connecting their final conductive layer, forming a trench between the adjacent micro LED structures.

A micro LED element, a micro LED display panel, and a display device are provided. The micro LED display panel includes a micro LED chip including a driving layer and a micro LED array disposed on the driving layer, the driving layer being configured to receive signals for driving the micro LED array; a substrate layer disposed on a back surface of the driving layer, the substrate layer including a reception structure not covered by the micro LED chip; and a molded layer disposed on the micro LED chip and the substrate layer, and disposed into the reception structure to collaboratively enclose a periphery of the micro LED chip with the substrate layer, leaving an open region above the micro LED array.