Company patents
Japan Aviation Electronics Industry, Ltd.
Japan Aviation Electronics Industry, Ltd. maintains an overwhelming focus on Electrical Connectors, which constitute nearly 90% of its patent portfolio, despite a slight dip of 4.2% in 2026 so far. Surprisingly, while Material & Chemical Analysis patents, a minor part of its portfolio, saw a 100% decline in 2026, the company is showing an emerging focus on Printed Circuits & Electronic Assemblies, with a significant 150.0% year-over-year growth in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
79 US filings (since 2023) · 4 categories · 7 themes
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Design techniques and components within connectors to minimize signal degradation, crosstalk, and impedance mismatches for high-frequency data transmission.
Patents
Showing 1-10 of 113