Company patents

Japan Aviation Electronics Industry, Ltd.

Japan Aviation Electronics Industry, Ltd. maintains an overwhelming focus on Electrical Connectors, which constitute nearly 90% of its patent portfolio, despite a slight dip of 4.2% in 2026 so far. Surprisingly, while Material & Chemical Analysis patents, a minor part of its portfolio, saw a 100% decline in 2026, the company is showing an emerging focus on Printed Circuits & Electronic Assemblies, with a significant 150.0% year-over-year growth in 2026.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

79 US filings (since 2023) · 4 categories · 7 themes

Robust Electrical Contact Systems

Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.

Electrical Connectors
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46since 2023
+200.0%YoY
Connector Locking Mechanisms

Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.

Electrical Connectors
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44since 2023
+180.0%YoY
Cable Termination & Management

Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.

Electrical Connectors
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42since 2023
+150.0%YoY
Power & Hybrid Connector Design

Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.

Electrical Connectors
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33since 2023
+120.0%YoY
Advanced Electronic Packaging

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
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1since 2023
new
Flexible and Printed Circuitry

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Printed Circuits & Electronic Assemblies
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1since 2023
new
High-Speed Signal Integrity

Design techniques and components within connectors to minimize signal degradation, crosstalk, and impedance mismatches for high-frequency data transmission.

Electrical Connectors
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1since 2023
n/a

Patents

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