Company patents
JESS-LINK PRODUCTS CO., LTD.
JESS-LINK PRODUCTS CO., LTD. surprisingly maintains a highly concentrated patent strategy, with 78.3% of its portfolio in Electrical Connectors, despite a notable 46.2% decline in new filings in this core area so far in 2026. Concurrently, the company shows an emerging focus on Printed Circuits & Electronic Assemblies, which experienced a significant 100.0% year-over-year growth in 2024, indicating a strategic shift towards more integrated electronic components.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
60 US filings (since 2023) · 6 categories · 14 themes
Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.
Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.
Structural design and manufacturing techniques for bundling multiple wires into harnesses, including protective layers like braiding and interlocking armor, and methods for assembly and termination.
Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.
Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.
Design techniques and components within connectors to minimize signal degradation, crosstalk, and impedance mismatches for high-frequency data transmission.
The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.
Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.
Heat transfer devices that utilize the phase change of a working fluid (evaporation and condensation) to efficiently move heat, often incorporating capillary structures, heat pipes, or vapor chambers.
Devices and systems designed to protect electrical circuits from overcurrents, short circuits, and other faults, often involving rapid response, high voltage/current handling, and sophisticated interruption mechanisms.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.
Patents
Showing 1-10 of 87