KCTECH CO., LTD.

A cleaning solution detection device includes a transfer part configured to unload and transfer a substrate having a surface to which a cleaning solution is applied when a cleaning process is completed, a detector configured to detect the cleaning solution that falls from the surface of the substrate in a process in which the substrate is unloaded and transferred by the transfer part, and a controller configured to determine whether a dangerous situation occurs due to a fall of the cleaning solution based on information detected by the detector.

The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.

A substrate processing apparatus is disclosed. The substrate processing apparatus includes a chamber having a processing space in which substrate processing is performed therein, one or more exhaust lines connected to the chamber and configured to discharge a processing fluid from the processing space to an outside of the chamber, a supporting chuck disposed in the processing space, configured to support the substrate from below so that the substrate is disposed on an upper portion of the supporting chuck, and having an inner space configured to accommodate a first processing fluid, and one or more first supply lines configured to receive the first processing fluid from the outside of the chamber and transfer the first processing fluid to the inner space of the supporting chuck. In addition, various embodiments may be possible.

Provided is a substrate cleaning apparatus, comprising: a substrate support unit for rotating and holding a substrate; a brush unit for cleaning the substrate with a cleaning brush formed in the form of a roll and rotating in contact with a surface of the substrate; and a vibration sensor installed on the brush unit to detect vibrations generated by the contact of the cleaning brush with the substrate, thereby improving process efficiency by predicting cleaning results before cleaning is completed.

Disclosed is a substrate chuck. More particularly, a substrate chuck including a chucking film made of a flexible material capable of elastic deformation to cover a mounting region of an upper surface of a surface plate on which a substrate is to be mounted; and a substrate chuck for gripping the substrate by applying suction pressure to a lower part of the chucking film to form a vacuum between the chucking film and the substrate; and a substrate scrubbing apparatus including the substrate chuck are provided.

Provided is a high-precision substrate polishing system. An apparatus for polishing a substrate includes a platen on which a polishing pad is seated and which is rotatable, a substrate carrier configured to grip a substrate and rotatable on an upper side of the platen, an infrared sensor located inside the platen and configured to measure a temperature of the substrate, and a controller configured to determine a polishing state of the substrate using a value measured by the infrared sensor.

A substrate processing system, according to one embodiment, comprises: a cleaning device, positioned at a first position, for performing a cleaning process for a substrate; a drying device, positioned at a second position, for performing a drying process for the substrate; and a transfer unit for transferring the substrate from the cleaning device to the drying device, wherein the first position and the second position may be vertically arranged.

A robot arm includes a first hand, a second hand, and a distance adjusting part for adjusting a distance between the first hand and the second hand. The first hand includes a first body portion and a plurality of first protruding portions protruded from the first body portion to a second direction and arranged in a first direction crossing the second direction. The second hand includes a second body portion and a plurality of second protruding portions protruded from the second body portion to the second direction and arranged in the first direction. The first protruding portions and the second protruding portions are disposed between the first body portion and the second body portion.

The substrate processing device according to one embodiment may comprise: a chamber unit provided with a processing space therein and comprising an inclined chamber surface having an opening; a door unit comprising an inclined door surface, which corresponds to the inclined chamber surface, and capable of being coupled to the chamber unit; and a door driving unit for driving the door unit so as to open/close the processing space.

Provided is a slurry composition for a metal film for a contact process. A polishing slurry composition includes abrasive particles, a compound including one or more functional groups capable of hydrogen bonding, a nonionic polymer including one or more hydrophilic functional groups in a repeating unit structure, and an oxidizer.