Company patents

KEMET Electronics Corporation

KEMET Electronics Corporation's patent strategy is overwhelmingly focused on "Capacitors," which constitute 95.7% of its portfolio, yet this core area has seen a significant decline in patenting activity, with a -21.4% YoY drop in 2025 and a -63.6% decline so far in 2026. This suggests a shifting priority away from its traditional strength, despite a brief emerging focus in "Polymer Synthesis (Polycondensation)" which saw a +200.0% YoY growth in 2025 before a sharp decline in 2026.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

46 US filings (since 2023) · 12 categories · 11 themes

Solid Electrolytes for Capacitors

Explores the composition and integration of solid or gel-based electrolyte materials within various capacitor types, such as solid electrolytic capacitors and supercapacitors, to enhance performance, stability, and safety.

Capacitors
Who else files here? →
35since 2023
-9.1%YoY
Capacitor Packaging & Interconnection

Focuses on the physical design, materials, and methods for packaging capacitors and integrating them onto circuit boards, including external electrode structures, conductive adhesives, and mounting techniques to ensure reliable electrical and mechanical connections.

Capacitors
Who else files here? →
34since 2023
-38.5%YoY
Advanced Supercapacitor Electrodes

Involves the development of novel materials and porous structures for the electrodes of supercapacitors and other electrochemical energy storage devices, aiming for high charge density, improved performance, and flexibility.

Capacitors
Who else files here? →
25since 2023
-12.5%YoY
Multilayer Ceramic Capacitor Design

Focuses on the internal and external structural elements, material compositions (e.g., ceramic dielectrics, electrode metals), and manufacturing techniques used to create multilayer ceramic capacitors (MLCCs), including aspects like mechanical robustness and internal circuitry.

Capacitors
Who else files here? →
21since 2023
-42.9%YoY
Advanced Functional Ceramics

Ceramic materials and components engineered for specific functional applications, such as electronics, energy storage, wear resistance, or high-temperature heating elements.

Cement & Ceramics
Who else files here? →
8since 2023
-50.0%YoY
Advanced Electronic Packaging

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Printed Circuits & Electronic Assemblies
Who else files here? →
6since 2023
n/a
Polymers for Electronic Devices

Synthesis and formulation of polymers, such as epoxy resins, polyimides, or ionic binders, tailored for specific functions in electronic components like sealing, insulation, or energy storage.

Polymer Synthesis (Polycondensation)
Who else files here? →
1since 2023
new
Advanced Magnetic Powder Materials

Development and processing of metal powders with specific magnetic properties, including soft magnetic alloys, permanent magnet materials, and insulated powders for electronic components, often involving precise control of particle size, morphology, and composition.

Powder Metallurgy
Who else files here? →
1since 2023
new
Flexible and Printed Circuitry

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Printed Circuits & Electronic Assemblies
Who else files here? →
1since 2023
n/a
Wearable & Mobile Interaction

Designing user interfaces and interaction methods specifically for mobile or wearable devices, enabling control of external systems, monitoring user states, or facilitating real-world transactions.

Input/Output & User Interfaces
Who else files here? →
1since 2023
n/a
Flexible/Foldable Device Structures

Engineering solutions for creating electronic devices with bendable, foldable, or stretchable form factors, often involving hinges, flexible displays, and sliding mechanisms to enable dynamic physical configurations.

Hardware Platform (Cooling, Power, Packaging)
Who else files here? →
1since 2023
n/a

Patents

Showing 1-10 of 90

Page 1 of 9