Company patents

Kioxia Corporation

Kioxia Corporation's patent strategy shows a surprising shift, with a significant decline across most categories in 2025 and so far in 2026, including its core 'Memory & Storage (Static)' (35.1% of portfolio, -25.7% YoY in 2025) and 'Memory Devices (Structural)' (28.7% of portfolio, -22.7% YoY in 2025). While 'Memory Devices (Structural)' saw a massive 151.9% growth in 2024, this was followed by a sharp decline, and 'Integrated Circuit Layout & Arrangement' and 'Transistor & Device Structure' have seen near-total cessation of patenting activity, with 0 patents so far in 2026.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

4,794 US filings (since 2023) · 12 categories · 32 themes

Novel Memory Transistor Architectures

Design and operation of transistors optimized for memory applications, including floating body devices, ferroelectric FETs (FeFETs), vertical TFTs for 3D arrays, and charge-trapping memory cells.

Transistor & Device Structure
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2,719since 2023
-22.9%YoY
Advanced Memory Cell Structures

Focuses on the physical design, materials, and manufacturing processes for individual memory cells, including transistor structures, interconnects, and multi-layered (3D) architectures to enhance density and performance.

Memory & Storage (Static)Memory Devices (Structural)
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2,154since 2023
-21.0%YoY
Resistive & Phase Change Memory

Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.

Memory Devices (Structural)Inorganic Devices (Thermoelectric, Piezo)
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1,810since 2023
-25.7%YoY
Memory System Performance & Reliability

Hardware and control techniques for optimizing memory access latency, ensuring data integrity, and managing storage resources efficiently. This includes error correction, read/write voltage control, and intelligent data placement or in-memory computation.

Computer Hardware ArchitectureMemory & Storage (Static)
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1,467since 2023
-23.3%YoY
Semiconductor Device Manufacturing Processes

Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.

Transistor & Device Structure
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693since 2023
-35.0%YoY
3D Die Stacking & Vertical Interconnects

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Memory Devices (Structural)Semiconductor Packaging & EncapsulationMulti-Chip & 3D AssembliesChip-to-Chip Interconnect (Bonding, Bumps)
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670since 2023
-29.9%YoY
Memory Reliability, Testing & Repair

Methods and circuits for detecting and mitigating defects, ensuring data integrity, and enabling self-testing and repair mechanisms within memory devices and subsystems.

Memory & Storage (Static)
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648since 2023
-22.8%YoY
Novel Logic & Memory Circuit Elements

Design and implementation of non-traditional logic gates or memory elements, often leveraging new materials or device physics to achieve multi-functionality, adaptive thresholds, or higher density.

Integrated Circuit Layout & Arrangement
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169since 2023
-56.1%YoY
In-Memory Sensing & Data Pathfiltered

Design and operation of analog and mixed-signal circuits within the memory array, such as page buffers, sense amplifiers, and data latches, responsible for reading and writing data from/to memory cells.

Memory & Storage (Static)
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158since 2023
-38.8%YoY
Advanced Metallization & Contacts

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Chip-to-Chip Interconnect (Bonding, Bumps)
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129since 2023
-5.0%YoY
Wafer Handling and Process Environment Control

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Semiconductor Manufacturing Process
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117since 2023
-51.2%YoY
Advanced Material Integration

Incorporation of novel semiconductor, dielectric, or metallic materials into transistor structures to achieve enhanced performance, new functionalities, or specific device characteristics.

Transistor & Device Structure
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103since 2023
+8.0%YoY
Heterogeneous Chiplet Integration

Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.

Multi-Chip & 3D AssembliesMemory Devices (Structural)
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95since 2023
-15.6%YoY
Advanced Etching & Patterning Control

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Semiconductor Manufacturing Process
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68since 2023
-42.1%YoY
High-Speed Data Interconnects

Technologies for establishing and managing high-bandwidth, low-latency communication pathways between computing components, peripherals, or systems, focusing on signal integrity, synchronization, and interface standards.

Computer Hardware ArchitectureMulti-Chip & 3D Assemblies
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51since 2023
-40.0%YoY
Temporary Wafer Bonding & Debonding

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Semiconductor Manufacturing ProcessChip-to-Chip Interconnect (Bonding, Bumps)
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48since 2023
-56.2%YoY
Backside Contact & Interconnects

Techniques for forming electrical contacts, vias, and interconnects to semiconductor devices, including advanced methods like contact-over-active-gate (COAG) and backside contacts for improved density and performance.

Transistor & Device Structure
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45since 2023
-35.3%YoY
Gate Stack & Dielectric Engineering

Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.

Transistor & Device Structure
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34since 2023
-22.2%YoY
Advanced Transistor Device Architectures

Structural innovations in individual transistors, such as fin-based field-effect transistors (FinFETs), 3D gate structures, or multi-layer active regions, aimed at improving performance or density.

Integrated Circuit Layout & Arrangement
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32since 2023
-9.1%YoY
On-Chip Power Management & Protection

Integrated circuits or sub-circuits designed to regulate, balance, or protect power delivery within a device, often involving specific transistor and capacitor arrangements.

Computer Hardware ArchitectureIntegrated Circuit Layout & Arrangement
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32since 2023
0.0%YoY
Conformal & Selective Film Deposition

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Semiconductor Manufacturing Process
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26since 2023
+120.0%YoY
FinFET & Multigate Device Fabrication

Manufacturing processes and structural designs for transistors utilizing fin-shaped channels or multiple gates (e.g., FinFETs, Gate-All-Around FETs) to enhance gate control and reduce short-channel effects.

Transistor & Device Structure
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23since 2023
+100.0%YoY
Integrated Circuit Interconnect & Layout Optimization

Techniques for designing and fabricating the conductive pathways (interconnects) and their contacts between different components within an integrated circuit, focusing on density, reliability, and performance.

Integrated Circuit Layout & Arrangement
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20since 2023
+20.0%YoY
Interconnect Materials & Reliability

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

Chip-to-Chip Interconnect (Bonding, Bumps)
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20since 2023
-25.0%YoY
Encapsulation Materials & Processes

Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.

Semiconductor Packaging & Encapsulation
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19since 2023
-28.6%YoY
Specialized Compute Architectures

Novel hardware designs and processing pipelines tailored for specific computational tasks, such as graphics rendering, neural network operations, or matrix transformations, often involving custom circuits, memory arrays, or data flow mechanisms.

Computer Hardware Architecture
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16since 2023
0.0%YoY
Package Thermal Management

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Semiconductor Packaging & EncapsulationMulti-Chip & 3D Assemblies
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14since 2023
-85.7%YoY
AI/ML Hardware Acceleration

Specialized hardware, architectural designs, and computational methods to improve the speed, efficiency, and security of artificial intelligence and machine learning model execution, particularly for inference and data processing.

Computer Hardware Architecture
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7since 2023
-66.7%YoY
Vertical Interconnects & Vias

Design and manufacturing methods for creating vertical electrical connections, such as conductive pillars, via-wirings, and contact rings, which are essential for connecting different layers in 3D integrated circuits and packages.

Memory Devices (Structural)
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4since 2023
n/a
Chemical Mechanical Planarization & Wet Surface Treatment

Processes involving chemical and mechanical forces to planarize surfaces (CMP) or wet chemical treatments for cleaning, etching, or material removal, often utilizing specialized compositions, nozzles, or fluid management systems.

Semiconductor Manufacturing Process
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3since 2023
-50.0%YoY
Electronics Encapsulation & Sealing

Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.

Semiconductor Packaging & Encapsulation
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3since 2023
n/a
Data Resiliency & Recovery

Encompasses strategies and technologies to ensure the availability, integrity, and recoverability of data and systems, including robust backup, replication, error correction, and efficient data restoration.

System Reliability & Diagnostics
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3since 2023
n/a

Patents

Showing 31-40 of 248

In-Memory Sensing & Data Path
Page 4 of 25