Company patents
KLA Corporation
KLA Corporation's patent strategy reveals a strong, consistent focus on its core areas of Material & Chemical Analysis (27.9% of portfolio) and Photolithography (26.3%), with Photolithography showing a significant 28.3% YoY growth in 2024. While many categories show a decline in patenting activity so far in 2026, the company demonstrated an emerging focus on Machine Learning & AI, which experienced a remarkable 150.0% YoY growth in 2025, and Computer Vision, which grew by 75.0% YoY in 2025, indicating a strategic push into advanced computing applications despite their smaller share of the overall portfolio.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
735 US filings (since 2023) · 12 categories · 31 themes
Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.
Techniques and apparatus for measuring critical dimensions, overlay accuracy, defect detection, and surface topography in lithographic processes, often involving optical, laser, or charged particle beams.
Methods and apparatus for precise wafer positioning, ion beam uniformity, and dose monitoring during ion implantation processes in semiconductor device manufacturing.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Techniques and systems for measuring three-dimensional shapes, depths, or surface profiles using optical principles, including diffraction, interferometry, structured light, and imaging.
Techniques and systems for real-time or near-real-time measurement and adjustment of semiconductor manufacturing parameters (e.g., temperature, etch rate, ion beam uniformity) to ensure process quality and consistency.
Techniques and devices for generating, shaping, focusing, and deflecting electron or ion beams, often involving multi-pole lenses, deflectors, and aberration correction for applications like microscopy or processing.
Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Systems and methods for delivering radio frequency (RF) power to plasma processing chambers, including impedance matching, pulse shaping, and feedback control for stable and efficient plasma generation.
Design and control of plasma processing chambers, including heating, gas delivery, electrode configurations, and magnetic field control for uniform and efficient material processing in semiconductor manufacturing.
Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.
Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.
Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.
Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.
Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.
Systems and methods for accurately measuring and compensating for position, orientation, and movement errors in mechanical systems, often for manufacturing, robotics, or optical alignment.
Techniques and apparatus for achieving and maintaining vacuum conditions within charged particle and plasma processing chambers, including pump control, vacuum degree monitoring, and chamber sealing.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Application of machine learning models and algorithms to interpret complex optical sensor data for tasks such as object classification, anomaly detection, health monitoring, or environmental state determination, enhancing automation and decision-making.
Innovations in the physical design, materials, fabrication, or packaging of photodetectors and optical sensor elements, including thermoelectric, NIR-compliant, and self-mixing interference types, to improve performance or integration.
Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.
Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.
Systems and methods enabling the monitoring, configuration, and operation of industrial equipment and processes from a distance, often utilizing wireless communication protocols and networked platforms for enhanced flexibility and access.
Developing and applying machine learning algorithms that leverage quantum computing principles, such as quantum circuits or autoencoders, for tasks like simulation or data processing.
Systems and methods for automating the lifecycle of machine learning models, including pipeline deployment, model management, versioning, and configuring for different inference environments.
Integrated systems that combine multiple types of measurements (e.g., dimensional, thermal, strain, flow) to monitor and control industrial processes, structural integrity, or product quality.
Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.
Utilizing machine learning, particularly deep learning, to analyze medical data such as images, sensor readings, or physiological signals for disease prediction, diagnosis, or treatment assessment.
Methods and compositions for identifying, quantifying, or characterizing specific biological molecules (e.g., nucleic acids, proteins, metabolites, antibodies) or microbial species, often for diagnostic, prognostic, or quality control applications.
Patents
Showing 1-10 of 23
Advanced Etching & Patterning Control