Company patents
Kulicke and Soffa Industries, Inc.
Kulicke and Soffa Industries, Inc,. maintains a strong focus on its core 'Chip-to-Chip Interconnect (Bonding, Bumps)' with 54.3% of its portfolio, showing a significant 50.0% YoY growth in 2025, while surprisingly, 'Semiconductor Manufacturing Process' saw a dramatic 400.0% YoY increase in 2025, suggesting an emerging emphasis on broader semiconductor production techniques beyond its traditional interconnect strengths, despite a partial decline so far in 2026.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
105 US filings (since 2023) · 9 categories · 14 themes
Specialized welding or bonding techniques and apparatuses tailored for joining small-scale electronic components, integrated circuits, or semiconductor wafers, emphasizing precision, miniaturization, and electrical connectivity.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Design and features of welding and soldering tools, fixtures, and accessories that enhance user safety, ergonomics, operational efficiency, and precise workpiece manipulation, including protective equipment and clamping mechanisms.
Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.
Systems and methods for precisely controlling welding parameters such as power, speed, oscillation, and material feed to optimize weld quality, consistency, and efficiency, often involving automated or semi-automated processes.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.
Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.
Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.
Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.
Systems and methods for assessing the quality and characteristics of welds or solder joints, often involving non-destructive testing (NDT) techniques, image processing, or real-time feedback for process control and defect detection.
Development of novel chemical compositions for fluxes, solders, and filler metals to improve material properties, enhance joint reliability, reduce defects, or meet specific application requirements like high-temperature reflow or specialized material joining.
Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.
Patents
Showing 41-50 of 150