Company patents
LASERTEC CORPORATION
LASERTEC CORPORATION's patent strategy reveals a strong, sustained focus on its core Material & Chemical Analysis (28.6% of portfolio) and Photolithography (26.5% of portfolio) areas, with Photolithography showing robust growth of +150.0% in 2025. Surprisingly, despite its name, the company has a relatively small and declining patent presence in Lasers, with zero patents so far in 2026, indicating a shifting priority away from direct laser technology development.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
49 US filings (since 2023) · 12 categories · 13 themes
Techniques and apparatus for measuring critical dimensions, overlay accuracy, defect detection, and surface topography in lithographic processes, often involving optical, laser, or charged particle beams.
Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.
Components, processes, and methods specifically designed for Extreme Ultraviolet (EUV) lithography, including light sources, reflective optics, masks, pellicles, and contamination control mechanisms.
Innovations in the design, materials, and manufacturing of lithography masks, including reflective masks, programmable masks, and defect mitigation strategies, to enable finer feature patterning and process control.
Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.
Mechanisms and designs for actively changing or stabilizing the output wavelength, frequency, or spectral properties of a laser, often involving integrated optical filters, resonators, or pump adjustments.
Inspection and testing methods specifically designed for wafers before, during, or after bonding processes, including verification of bonding surfaces, alignment, and defect detection in multi-wafer or stacked die assemblies.
Methods and apparatus for improving the visual fidelity, resolution, or compression efficiency of video signals, often through advanced processing, up-scaling, or neural network-based filters.
Methods and structures for assembling laser chips into functional modules, encompassing optical alignment, electrical interconnection, mechanical support, thermal management, and encapsulation for protection.
Techniques and systems for ensuring the safe and precise operation of lasers, including power regulation, hazard detection, and deconfliction mechanisms in complex or dynamic environments.
Design and integration of lasers and associated components specifically for transmitting data over optical fibers or through free space, including modulation schemes and efficient light coupling.
Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.
Systems that combine light sources, waveguides, and display elements into unified products for backlighting, automotive applications, general lighting, or color-corrected displays.
Patents
Showing 1-10 of 58