Lextar Electronics Corporation

A semiconductor device includes a driving element, a light-emitting element, a light-sensing element, a cover layer, first electrical connecting layers, and second electrical connecting layers. The light-emitting element and the light-sensing element are arranged side by side on the driving element. The cover layer covers the light-emitting element, the light-sensing element, and the driving element. The first electrical connecting layers and the second electrical connecting layers are arranged between the cover layer and the driving element. The light-emitting element is connected to the driving element via the first electrical connecting layers and the light-sensing element is connected to the driving element via the second electrical connecting layers. The cover layer includes a first opening and a second opening. The first opening is arranged on the light-emitting element to expose the light-emitting element. The second opening is arranged on the light-sensing element to expose the light-sensing element.

A light-emitting diode package is provided. The light-emitting diode package includes a light-emitting diode chip, a wavelength conversion layer, a dielectric layer, a distributed Bragg reflector layer, a conductive component, and a reflective layer. The light-emitting diode chip includes a light-emitting surface and a plurality of side surfaces. The wavelength conversion layer is disposed on the light-emitting surface of the light-emitting diode chip, and the wavelength conversion layer includes a plurality of side surfaces. The dielectric layer covers the side surfaces of the light-emitting diode chip. The distributed Bragg reflector layer is disposed below the light-emitting diode chip. The conductive component is disposed below the distributed Bragg reflector layer and electrically connected to the light-emitting diode chip through the distributed Bragg reflector layer. The reflective layer is disposed on the side surfaces of the wavelength conversion layer.

A light-emitting module is provided. The light-emitting module includes a light source and a lens structure disposed on the light source. The lens structure has a first surface and a second surface. The second surface is opposite to the first surface and adjacent to the light source. The first surface includes a first recessed portion and a plurality of second recessed portions. The first recessed portion corresponds to the light source. The second recessed portions are located in the extending direction of the first recessed portion. The second surface has a reflective surface located between the first recessed portion and the second recessed portions.

A packaging structure is provided. The packaging structure includes a dielectric structure, a redistribution structure, a plurality of light-emitting elements, a color conversion layer, and a metal barrier wall. The redistribution structure is disposed in the dielectric structure. The plurality of light-emitting elements is disposed on the dielectric structure and electrically connected to the redistribution structure. The color conversion layer is disposed on the plurality of light-emitting elements. The metal barrier wall is disposed on the dielectric structure and surrounds the color conversion layer.

A packaging structure is provided. The packaging structure includes a dielectric layer, a redistribution layer, a plurality of light-emitting elements, a photodegradation prevention layer, and a cover layer. The redistribution layer is disposed on the dielectric layer. The plurality of light-emitting elements is disposed on the redistribution layer and electrically connected to the redistribution layer. The photodegradation prevention layer is disposed on the dielectric layer and surrounds the plurality of light-emitting elements. The cover layer is disposed on the plurality of light-emitting elements and the photodegradation prevention layer. The area of the photodegradation prevention layer accounts for at least 50% of the area of the cover layer.

A packaging structure is provided. The packaging structure includes a first dielectric layer, a redistribution structure, a plurality of light-emitting elements, an integrated circuit element, and a cover layer. The first dielectric layer has a top surface and a side surface. The redistribution structure is disposed in the first dielectric layer. The plurality of light-emitting elements is disposed on the first dielectric layer. The integrated circuit element is disposed on the first dielectric layer and adjacent to the plurality of light-emitting elements. The cover layer is disposed on the plurality of light-emitting elements and the integrated circuit element. The cover layer surrounds the plurality of light-emitting elements and the integrated circuit element. The cover layer is in direct contact with the top surface and the side surface of the first dielectric layer.

A light source module is provided. The light source module includes a substrate for the product, a plurality of first light sources and a plurality of second light sources. The first light sources are disposed on the substrate for the product, wherein the first light sources provide a first light beam, and the first light beam has a first chromaticity. The second light sources are disposed on the substrate for the product, wherein the second light sources provide a second light beam, the second light beam has a second chromaticity, and there is a chromaticity difference (Rx, Ry) between the first chromaticity and the second chromaticity.

A package structure is provided. The package structure has a light-emitting region and a non-light-emitting region that is adjacent to the light-emitting region, and includes a substrate, a first light-emitting layer, a second light-emitting layer and a third light-emitting layer. The first light-emitting layer, the second light-emitting layer and the third light-emitting layer are sequentially stacked on the substrate. Each of the first light-emitting layer, the second light-emitting layer and the third light-emitting layer includes a transparent adhesive layer disposed in the light-emitting region, a light-emitting diode (LED) chip disposed on the transparent adhesive layer, a redistribution layer formed on the LED chip and extending from the light-emitting region to the non-light-emitting region, and a planarization layer disposed on the LED chip and the redistribution layer.

A light-emitting diode device includes light-emitting diodes, a storage module, a control module, a driving module, and a package structure. The light-emitting diodes emit different colors of light. The storage module pre-stores color coordinate reference information and brightness reference information corresponding to a current/voltage of the light-emitting diodes. The control module receives the color coordinate reference information and the brightness reference information corresponding to the light-emitting diodes, and uses the color coordinate reference information, the brightness reference information, the color coordinate requirement information, and the brightness requirement information according to a light mixing algorithm to generate a first control signal. The driving module generates a driving signal according to the first control signal to drive the light-emitting diodes to emit a light having a color coordinate and brightness that meet requirements. The package structure accommodates the light-emitting diodes, the storage module, the control module, and the driving module.