Lextar Electronics Corporation

A micro LED structure includes a first micro LED chip having opposite first and second sides, a second micro LED chip adjacent to the first side of the second micro LED chip, a third micro LED chip adjacent to the first side of the first micro LED chip, and optical structures respectively over the first micro LED chip, the second micro LED chip and the third micro LED chip. Each of the first, second and third micro LED chip includes a semiconductor stack, a metal pad and a reflective coating layer. The semiconductor stack includes a first semiconductor layer, an active layer in contact with the first semiconductor layer, and a second semiconductor layer in contact with the active layer. The metal pad is in contact with the first semiconductor layer, and the reflective coating layer is disposed around sidewalls of the semiconductor stack.

A semiconductor chip comprises a semiconductor stack and a passivation layer. The semiconductor stack comprises a top surface, a bottom surface opposite to the top surface, and a plurality of sidewalls between the top surface and the bottom surface. The passivation layer conformally covers the top surface and the sidewalls of the semiconductor stack. When viewing from the bottom surface, a plan-view contour of the semiconductor stack comprises a plurality of edges and corners. Each of the corners is defined by two adjacent edges. A plan-view contour of the passivation layer surrounding the plan-view contour of the semiconductor stack comprises a protruding portion adjacent to one of the corners and the protruding portion protrudes outwards from the plan-view contour of the passivation layer.

A light-emitting structure includes a substrate, a light-emitting device, a light reflective layer, and a reflective microstructure. The light-emitting device, which includes a top surface and side surfaces, is disposed on the substrate. The light reflective layer is disposed above the top surface of the light-emitting device to reflect a portion of the light being emitted from the top surface of the light-emitting device towards the side surfaces of the light-emitting device. The reflective microstructure is disposed on the substrate and surrounding the side surfaces of the light-emitting device to reflect the light being emitted from the side surfaces of the light-emitting device.

A light-emitting device and a display device are provided. The light-emitting device includes a substrate, a light-emitting array, and a plurality of first color conversion points. The light-emitting array is disposed on the substrate and includes a plurality of light-emitting units. Each one of the plurality of light-emitting units includes a LED die and an encapsulating portion. The LED die is disposed on the substrate. The encapsulating portion is disposed on the substrate and covers the LED die. The plurality of first color conversion points is disposed on the substrate and surrounds the light-emitting array. The plurality of first color conversion points includes a first wavelength conversion material.

A micro light-emitting diode package structure is provided. The micro light-emitting diode package structure includes a plurality of micro light-emitting diode chips, a light-transmitting layer, a first insulating layer, a driving element, and a redistribution layer. The micro light-emitting diode chips are disposed side by side, wherein each micro light-emitting diode chip includes an electrode surface and a light-emitting surface opposite to each other. The light-transmitting layer covers the light-emitting surfaces of the micro light-emitting diode chips. The first insulating layer is disposed below the micro light-emitting diode chips. The driving element is disposed in the first insulating layer, wherein the driving element includes a plurality of electrodes, and the electrodes are on the side of the driving element away from the micro light-emitting diode chips. The redistribution layer electrically connects the electrode surfaces of the micro light-emitting diode chips and the electrodes of the driving element.

A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.

An optical structure is provided. The optical structure includes a substrate, a light-emitting element, a glue layer, and a light-adjusting element. The light-emitting element is disposed on the substrate. The glue layer covers the light-emitting element. The light-adjusting element is disposed on the glue layer. Moreover, the refractive index of the glue layer is different from the refractive index of the light-adjusting element.

A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.

A package structure is provided. The package structure includes a lead frame, a first connecting piece, a light-emitting diode, an engaging protrusion, and a fluorescent encapsulant. The lead frame has an upper surface, a lower surface, and a side surface between the upper surface and the lower surface. The first connecting piece is disposed at the center of the upper surface. The light-emitting diode is disposed on the first connecting piece. The engaging protrusion is disposed on the periphery of the upper surface. The fluorescent encapsulant is disposed on the upper surface and covers the light-emitting diode and the engaging protrusion.

A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.