LINTEC CORPORATION

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Development of adhesive compositions that are applied in a molten state and solidify upon cooling, focusing on specific polymer blends, additives, and their resulting mechanical or optical properties.

Adhesive technologies focused on environmental benefits such as biodegradability, natural origin, or designed for easy debonding and re-bonding to facilitate recycling, reuse, or specific application needs.

Adhesive systems designed to lose their adhesive properties or debond upon exposure to specific wavelengths of light, often utilized for temporary bonding in sensitive manufacturing processes like semiconductor fabrication.

Design and integration of thermoelectric modules for converting heat into electricity (power generation) or using electricity for cooling/heating, often involving p-type/n-type semiconductor pellets and waste heat recovery.

Thin, multi-layered films and structures specifically designed for electronic applications, including flexible substrates for devices, display panel components, and active material layers for battery electrodes.

Adhesive compositions specifically formulated to bind active materials within battery electrodes, emphasizing properties like electrolyte resistance, adhesion to current collectors, and processability for manufacturing.

Techniques for manufacturing thin polymer layers, sheets, or multi-layer structures, often optimized for specific properties such as flexibility, barrier function, filtration, or mechanical strength.

Focuses on novel heating elements, power delivery, and thermal management for efficient and controlled aerosol generation. This includes resistive, inductive, and other heating methods, as well as heat distribution and retention.

Novel formulations and mechanisms for initiating or controlling the polymerization and cross-linking of adhesives, including dual-curing systems, radical polymerization, and partial curing for tailored material properties.

Polymer compositions incorporating inorganic or organic filler materials to impart specific functional properties such as thermal conductivity, flame retardancy, electrical conductivity, or enhanced mechanical strength and dimensional stability.

Adhesive formulations designed for high transparency and minimal light distortion, primarily used in optical components, display devices, and protective films where visual clarity is paramount.

Materials added to polymers to modify their thermal transfer properties, typically increasing conductivity for heat dissipation in applications like electronics or battery packs.

Layered glass or film structures designed to optimize optical (e.g., light transmission, reflection, diffusion) and/or thermal (e.g., insulation, heat reflection/absorption) performance in windows, displays, and lighting applications.

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

Multi-layer polymer films engineered to provide superior barrier properties against gases (e.g., oxygen), moisture, or aromas, often incorporating heat-sealing or resealing mechanisms for food and product preservation.

Systems that combine light sources, waveguides, and display elements into unified products for backlighting, automotive applications, general lighting, or color-corrected displays.

Slurry compositions and coating processes for battery electrodes, including binder/active-material slurries, surface coating layers, and electrode-to-foil adhesion for cathode and anode.

Additives or compositions specifically formulated for surface application or modification to impart protective, decorative, or specialized functional properties to polymer products.

Active anode materials and manufacturing techniques for rechargeable lithium-ion batteries, including silicon-carbon composites, graphite, lithium-metal anodes, and electrode coating processes that improve capacity, cycle life, and rate capability.

Chemical additives or surface treatment methods aimed at improving the bonding strength of adhesives to various substrates, including those with challenging surface chemistries or contaminants.

Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.

Methods and tooling for forming structural components from fibrous materials impregnated with resin, involving processes like prepreg handling, resin infusion, and co-bonding during curing.

Process and equipment for producing solid-state battery cells, including solid electrolyte synthesis (sulfide/oxide/polymer), thin-film deposition, lamination, sintering, dry-electrode fabrication, and stacking under controlled atmosphere.

Substances incorporated into polymer systems to control or enhance adhesive properties, cross-linking reactions, or processing characteristics such as mold release and flow.

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Multi-layered materials incorporating fiber layers (e.g., carbon, non-carbon, fabric, mesh) within a polymer or ceramic matrix to achieve enhanced mechanical properties such as strength, stiffness, impact resistance, or tailored hardness for demanding structural applications.

Processes involving the application of heat and pressure to shape thermoplastic or elastomeric materials, often using molds or presses, to achieve specific forms or material properties.