LINXENS HOLDING

The present invention refers to a dual interface electronic module for a smart card and to the fabrication method thereof. The dual interface electronic module comprises a contact plate for external connection, which includes at least one antenna electrical connector, and a multilayered PCB including a value-add component, for instance a display. The contact plate and the multilayered PCB are connected together by means of a plurality of interconnects at an interconnection interface; the contact plate has a first area in correspondence of the interconnection interface and the multilayered PCB has a second area in correspondence of the interconnection interface. The first area is larger than the second area, so as to define an excess portion and at least one portion of the at least one antenna electrical connector is placed on the excess portion so as to be exposed for being electrically connected to a corresponding antenna of the smart card. The present invention also refers to the smart card comprising such a dual interface electronic module and to the fabrication method thereof.

The invention relates to a reel-to-reel process for manufacturing a carrier for electronic components, including a step during which at least one electronic component is transferred to a substrate. The electronic component includes at least one zone called the bonding zone and at least one zone called the connecting zone. The step of transferring the electronic component to the substrate includes bringing said bonding zone of the electronic component into contact with an adhesive face of the substrate, said bonding zone being distinct from said connecting zone. Furthermore, during the transferring step, a fastening zone is left free, on the side of the adhesive face of the substrate, this fastening zone being configured to subsequently receive a layer for fastening the electronic component to a chip card.

The present invention relates to an electronic carrier for antennas for a smartcard comprising an antenna substrate, a first wire antenna configured to provide energy to a lighting element for a smartcard, and a second wire antenna configured to provide energy to an electronic module for contactless data transferfor a smartcard, wherein the first antenna and the second antenna are formed on opposite sides of the antenna substrate. The present invention also refers to a lighting device for a smartcard comprising a lighting element configured for illuminating a portion of the smartcard and a single diode suitable for providing energy to the lighting element when connected to an energy harvesting antenna. Furthermore, the present invention refers to a pre-laminated structure for a smartcard and a smartcard comprising said electronic carrier and/or said lighting device.

The present invention relates to an electronic carrier for antennas for a smartcard comprising an antenna substrate, a first wire antenna configured to provide energy to a lighting element for a smartcard, and a second wire antenna configured to provide energy to an electronic module for contactless data transfer for a smartcard, wherein the first antenna and the second antenna are formed on opposite sides of the antenna substrate. The present invention also refers to a lighting device for a smartcard comprising a lighting element configured for illuminating a portion of the smartcard and a single diode suitable for providing energy to the lighting element when connected to an energy harvesting antenna. Furthermore, the present invention refers to a pre-laminated structure for a smartcard and a smartcard comprising said electronic carrier and/or said lighting device.

The invention relates in various aspects to a printed circuit for integration into a smart card, a smart card with such a printed circuit and to a reel-to-reel tape for use in a fabrication process of a smart card, wherein the reel-to-reel tape comprises a plurality of such printed circuit. In some illustrative embodiments of an aspect, a printed circuit is provided, the printed circuit comprising a printed circuit support, an antenna wiring pattern of at least one winding continuously extending between a first terminal and a second terminal, and at least one antenna path portion continuously extending between a third terminal and a fourth terminal. Herein, each of the at least one antenna path portion extending between the third and fourth terminal can increase a path length of the antenna wiring pattern if connected to the antenna wiring pattern, adding a path length of the at least one added antenna path portion to the initial path length of the antenna wiring pattern.

Method for the manufacture of a chip card module in which a polymer material including conductive particles is deposited in two connection wells or on two conductive pads formed in a conductive sheet positioned on the back face of the module. This polymer material forms, after deposition, an excess thickness on the back face which comes, during the insetting of the module, into contact with the ends of an antenna. Between the manufacture of the modules and their insetting, the modules are positioned on a strip which can be rolled up on itself for the purpose of its storage.

In aspects, the present invention relates to a wire pad design of a connection pad in a prelam body of a smart card, to a prelam body with at least one such connection pad embedded into a substrate, to a smart card comprising such a prelam body, to a method of forming a wire pad design of a connection pad of a prelam body of a smart card, and to a method of forming a smart card. In some illustrative embodiments, a wire pad design of a connection pad in a prelam body of a smart card is provided, the wire pad design comprising a connection pad wiring pattern formed by plural wire portions extending in a contacting pad plane, and a bridging wire portion which at least partially extends outside the contacting pad plane. The bridging wire portion electrically and mechanically connects at least some of the plural wire portions with each other.

The present invention provides for a prelam body of a smart card, a smart card, a method of forming a prelam body of a smart card, and a method of forming a smart card. In accordance with some embodiments herein, a prelam body comprises a base substrate formed of at least one layer, and at least one overlay sheet layer formed on one side of the base substrate, wherein the at least one overlay sheet layer has a recess formed therein. The recess is at least partially extending through the at least one overlay sheet layer such that an opening of the recess is exposed.

Electrical circuit for a smart card chip module, including an insulating layer having a front main face and a rear main face. An antenna is made in a first conductive layer laying on the rear main face. This antenna extends over an antenna area delimited by a peripheral edge. The antenna includes at least one inner loop and one outer loop. The outer loop runs along the peripheral edge except over at least one first connecting segment diverted from the peripheral edge, towards or in a central zone of the antenna area. Further, the outer loop of the antenna includes at least a second connecting segment diverted from the peripheral edge towards a central zone of the antenna area.

When forming smartcards or pre-forms thereof additional functionality may be implemented by, for instance, incorporating components, such as a display device, and the like, by preparing pre-packages separately from the rest of the pre-forms and subsequently inserting the pre-packages into the pre-forms, thereby achieving superior process robustness and production yield.