Littelfuse, Inc.

Devices and systems designed to protect electrical circuits from overcurrents, short circuits, and other faults, often involving rapid response, high voltage/current handling, and sophisticated interruption mechanisms.

Methods and structures employed within switches and circuit breakers to safely and efficiently quench electrical arcs generated during contact separation, preventing damage and ensuring reliable interruption.

Circuit breaker designs that combine mechanical switches with power semiconductors or solely use solid-state components to achieve faster fault interruption, current limiting, and arc suppression in AC or DC power systems.

Techniques and circuits for accurately identifying various electrical faults, such as ground faults, overcurrent, short circuits, switch malfunctions, or electrostatic discharge (ESD) events, often utilizing sensors, signal processing, and diagnostic algorithms.

Techniques and methodologies for fabricating semiconductor devices, including etching, deposition, annealing, isolation, and doping steps, aimed at improving yield, performance, or enabling new structures.

Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.

Intelligent control systems that manage the connection and disconnection of power, including pre-charging capacitive loads, reclosing after faults, or isolating parts of a grid based on detected conditions, often involving smart switches and relays with adaptive logic.

Focuses on novel heating elements, power delivery, and thermal management for efficient and controlled aerosol generation. This includes resistive, inductive, and other heating methods, as well as heat distribution and retention.

Techniques for measuring, monitoring, and compensating for temperature variations within semiconductor devices, integrated circuits, or photonic components to maintain performance, prevent degradation, and ensure reliability across operating conditions.

Methods and devices for integrating temperature sensors directly into materials, structures, or challenging environments (e.g., hydrogen tanks, concrete, ocean) to measure internal or localized temperatures.

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Specialized circuits and devices designed to protect electrical and electronic systems from transient overvoltages caused by electrostatic discharge (ESD) or power surges, often involving suppressor diodes, gas discharge tubes (GDTs), or voltage clamping mechanisms.

Techniques for forming electrical contacts, vias, and interconnects to semiconductor devices, including advanced methods like contact-over-active-gate (COAG) and backside contacts for improved density and performance.

Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.

Technologies for efficiently delivering power to electric vehicles, encompassing fast charging, wireless charging, and smart grid integration, alongside vehicle-side control and management of the charging process.

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Systems and methods for preparing, organizing, and electrically connecting individual conductors or cable bundles to connector terminals, ensuring reliable contact and strain relief.

Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.

Mechanical, electromagnetic, or hydraulic systems used to physically operate the contacts of a switch or circuit breaker, focusing on the linkages, motors, coils, or fluid dynamics involved.

Switches designed for specific applications within larger systems (e.g., automotive, IoT, industrial control), often incorporating sensors, control logic, wireless communication, or specialized mechanical interfaces.

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

Connectors specifically designed for high current or voltage applications, often incorporating features for power delivery, thermal management, or combining power and signal lines.

Temperature sensing systems integrated into wearable devices or medical apparatus for monitoring physiological conditions, such as inflammation detection, often utilizing differential temperature measurements.

Mechanical features or components integrated into connector housings or mating interfaces to ensure secure engagement and prevent accidental disengagement.

Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.

Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.

Systems designed to manage the temperature of multiple components in electric or hybrid vehicles, such as batteries, electric motors, power electronics, and the passenger cabin, often using shared or interconnected cooling/heating circuits.