Company patents

Lodestar Licensing Group LLC

Lodestar Licensing Group LLC's patent strategy shows a significant, albeit short-lived, surge in patent acquisitions across multiple computing and semiconductor categories in 2024, with categories like Memory & Storage (Static) and Computer Hardware Architecture seeing over 1200% YoY growth. This was followed by a sharp decline in patenting activity across most categories in 2025 and so far in 2026, suggesting a strategic shift away from aggressive portfolio expansion in these areas, with the exception of Industrial & Autonomous Control, which is showing an emerging focus with a 42.9% YoY growth in 2026 (partial data).

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

925 US filings (since 2023) · 12 categories · 21 themes

Memory System Performance & Reliability

Hardware and control techniques for optimizing memory access latency, ensuring data integrity, and managing storage resources efficiently. This includes error correction, read/write voltage control, and intelligent data placement or in-memory computation.

Memory & Storage (Static)Computer Hardware Architecture
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514since 2023
-23.7%YoY
Advanced Memory Cell Structures

Focuses on the physical design, materials, and manufacturing processes for individual memory cells, including transistor structures, interconnects, and multi-layered (3D) architectures to enhance density and performance.

Memory & Storage (Static)Memory Devices (Structural)
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328since 2023
+0.7%YoY
Memory Reliability, Testing & Repair

Methods and circuits for detecting and mitigating defects, ensuring data integrity, and enabling self-testing and repair mechanisms within memory devices and subsystems.

Memory & Storage (Static)
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216since 2023
-15.5%YoY
Resistive & Phase Change Memory

Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.

Memory Devices (Structural)
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186since 2023
-25.6%YoY
3D Die Stacking & Vertical Interconnects

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Memory Devices (Structural)Semiconductor Packaging & EncapsulationMulti-Chip & 3D Assemblies
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120since 2023
-20.0%YoY
In-Memory Sensing & Data Path

Design and operation of analog and mixed-signal circuits within the memory array, such as page buffers, sense amplifiers, and data latches, responsible for reading and writing data from/to memory cells.

Memory & Storage (Static)
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49since 2023
0.0%YoY
On-Chip Power Management & Protection

Integrated circuits or sub-circuits designed to regulate, balance, or protect power delivery within a device, often involving specific transistor and capacitor arrangements.

Computer Hardware Architecture
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20since 2023
-33.3%YoY
AI/ML Hardware Acceleration

Specialized hardware, architectural designs, and computational methods to improve the speed, efficiency, and security of artificial intelligence and machine learning model execution, particularly for inference and data processing.

Machine Learning & AIComputer Hardware Architecture
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16since 2023
-25.0%YoY
Heterogeneous Chiplet Integration

Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.

Multi-Chip & 3D Assemblies
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16since 2023
-25.0%YoY
Autonomous Path Planning

Algorithms and systems for generating, optimizing, and executing trajectories for autonomous vehicles or robots to move through an environment, often involving obstacle avoidance, route validation, and goal reaching.

Industrial & Autonomous Control
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12since 2023
-87.5%YoY
Fan-Out & Embedded Die Packaging

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

Multi-Chip & 3D AssembliesSemiconductor Packaging & Encapsulation
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9since 2023
-25.0%YoY
Specialized Compute Architectures

Novel hardware designs and processing pipelines tailored for specific computational tasks, such as graphics rendering, neural network operations, or matrix transformations, often involving custom circuits, memory arrays, or data flow mechanisms.

Computer Hardware Architecture
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8since 2023
-25.0%YoY
Wearable & Mobile Interaction

Designing user interfaces and interaction methods specifically for mobile or wearable devices, enabling control of external systems, monitoring user states, or facilitating real-world transactions.

Input/Output & User Interfaces
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7since 2023
0.0%YoY
High-Speed Data Interconnects

Technologies for establishing and managing high-bandwidth, low-latency communication pathways between computing components, peripherals, or systems, focusing on signal integrity, synchronization, and interface standards.

Computer Hardware ArchitectureMulti-Chip & 3D Assemblies
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7since 2023
-33.3%YoY
AR/VR User Interfaces

Techniques for rendering, interacting with, and managing content within augmented or virtual reality environments, including spatial tracking, gaze interaction, and dynamic multi-application display management.

Input/Output & User Interfaces
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5since 2023
+300.0%YoY
Package Thermal Management

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Semiconductor Manufacturing ProcessSemiconductor Packaging & EncapsulationMulti-Chip & 3D Assemblies
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3since 2023
-50.0%YoY
Advanced Package Interconnects

Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.

Semiconductor Packaging & Encapsulation
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3since 2023
n/a
Advanced Etching & Patterning Control

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Semiconductor Manufacturing Process
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2since 2023
0.0%YoY
AI/ML for Cryptographic Security

Applying artificial intelligence and machine learning techniques to enhance cryptographic systems, such as generating encryption models, improving zero-trust architectures, or enabling privacy-preserving computations like federated learning.

Computer Security
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2since 2023
0.0%YoY
Virtualization & Secure Remote Access

Technologies enabling the creation and management of virtual computing environments, including virtual machines and virtual desktops, with an emphasis on secure and efficient remote access, updates, and performance.

Operating Systems & Program Control
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2since 2023
n/a
Temporary Wafer Bonding & Debonding

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.

Semiconductor Manufacturing Process
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1since 2023
n/a

Patents

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