Lumileds LLC

Described is a light emitting diode (LED) array comprising: a plurality of phosphor-converted light-emitting diodes (PC-LEDs) arranged in a grid on a solid tile support, a reflective coating surrounding PC-LEDs in place, each of the PC-LEDs comprising: a die including an under bump metallization (UBM) affixing the PC-LED to a surface of the solid tile support; a phosphor layer affixed to a surface of the die opposite the UBM, and a transparent cover layer on the phosphor layer.

Described are light emitting diode (LED) arrays ( 100 ) comprising a plurality of mesas ( 101 a, b ) defining pixels having sidewalls, each of the mesas comprising semiconductor layers ( 108 ) having a total thickness ( 11 ), the semiconductor layers including an n-type layer ( 104 n ), an active region ( 106 ), and a p-type layer ( 104 p ). A plurality of junction spacers ( 118 ) comprise a dielectric material conformal to a portion of the sidewalls, and span a longitudinal distance of greater than or equal to 20% of the thickness (t 1 ) of the semiconductor layers. A plurality of cathodes comprising an n-contact material ( 114 ) between each of the mesas provide optical isolation therebetween, and electrically contact an uninsulated portion ( 105 ) of the n-type layer of each of the mesas along the sidewalls, the uninsulated portion of the n-type layer comprising a doped N-type material ( 104 n - d - 1 ). A surface ( 120 ) of the doped N-type material of the uninsulated portion of the n-layer is effective to provide an active metal-semiconductor contact.

A light-emitting diode (LED) die comprises: a plurality of pixels, each of the pixels comprising respective groups of epitaxial stacks included in a microLED comprising one or more tunnel junctions and light emitting layers of different colors, the plurality of pixels comprising: a first set of pixels configured to emit a red light; a second set of pixels configured to emit a green light; a third set of pixels configured to emit a blue light; the red light, the green light, and the blue light defining a RGB (red-green-blue) gamut; and a fourth set of pixels configured to emit a yellow light and to increase power efficiency of the device over that of a device with only RGB pixels.

A light-emitting apparatus includes a carrier substrate, an array of light-emitting devices on the carrier substrate, and carrier posts connecting the light-emitting devices to the carrier substrate spaced apart from the carrier substrate. The carrier post forms the only attachment between each light-emitting device and the carrier substrate, is positioned within the areal extent of the light-emitting device, and is attached to the light-emitting device at an attachment area thereof that occupies only a fractional portion of the areal extent of the light-emitting device. A transfer substrate can adhere to the light-emitting devices and then be separated from the carrier substrate with the light-emitting devices adhered thereto. The light-emitting devices can then be attached to a backplane, interconnect layer, or circuit board and the transfer layer removed leaving the behind the attached light emitting devices.

Three sets of LED layers each include p-doped and n-doped layers with an active layer therebetween, a tunnel junction layer against the p-doped layer, and an additional n-doped layer against the tunnel junction layer. The first and second LED layer sets are separated by a first semi-insulating semiconductor layer; the second and third LED layer sets are separated by a second semi-insulating semiconductor layer; the second LED layer set is between the first and second semi-insulating semiconductor layers; the third semiconductor layer set is between the second semi-insulating layer and a dielectric layer. Cathode contacts extend through the dielectric layer to the n-doped layers; anode contacts extend through the dielectric layer to the additional n-doped layers. The three LED layer sets can independently emit light at three different corresponding wavelengths, e.g., red, green, and blue light that can encompass an sRGB color gamut or can yield white light.

Various examples include a substrate and related method for bonding a first substrate formed from a cubic material to a second substrate formed from a non-cubic material. Other examples include a method of finding crystallographic planes of cubic materials being used as epitaxial substrates for non-cubic material epitaxy. By selecting low-index crystallographic planes, the two-dimensional (2D) repetitive pattern appears as parallelograms which enable epitaxy of non-cubic crystals. For example, an appropriate orientation in GaP has been identified as a substrate to the 0-Ga2O3 0-plane. In other embodiments, the disclosed subject-matter describes a method for determining crystallographic planes of cubic materials for bonding a first substrate formed from the cubic material to a second substrate formed from the non-cubic material. Other methods and techniques are also disclosed.

A light-emitting array includes a semiconductor LED structure, multiple outcoupling structures, multiple independent first electrical contacts, and second electrical contact(s). The LED structure extends contiguously over the array. The second electrical contacts are in electrical contact with the second semiconductor layer. Each outcoupling structure is a protruding portion of the second semiconductor layer. Each first electrical contact includes a circumscribed electrode layer opposite a corresponding outcoupling structure. Each outcoupling structure and corresponding first electrical contact define a corresponding discrete, circumscribed pixel region within the contiguous area of the array, each pixel region separate from the others. Some light emitted in the pixel region is collected or redirected by the outcoupling structure to exit the outcoupling structure and propagate away from the array.

A light emitting diode (LED) device comprises a plurality of pixels on a backplane, each pixel comprising: semiconductor layers, which include an N-type layer, an active region, and a P-type layer; a cathode electrically contacting the N-type layer; an anode comprising anode segments electrically contacting respective portions of the P-type layer; one or more dielectric materials insulating: the active region and the P-type layer from the cathode, the anode segments from each other, and the anode segments from the cathode; and a plurality of interconnects, each respective interconnect affixing a respective anode segment to the backplane. Methods of making and use the devices are also provided.

The invention refers to a method for assembling at least one lighting element onto a substrate, the method comprising: pre-assembling at least one lighting element onto a temporary carrier; pre-assembling at least one reference element onto the temporary carrier; aligning the pre-assembled temporary carrier onto the substrate based, at least in part, on the at least one reference element of the temporary carrier; and mounting the at least one lighting element onto the substrate. The invention further relates to substrate comprising: at least one lighting element, wherein the at least one lighting element is assembled onto the substrate, in particular by a method according to the first aspect of the present invention, and to a use of a method for assembling at least one lighting element onto a substrate.

A method of fabricating closely spaced pcLEDs ( 100 ) arranged in a matrix array ( 200 ) of perpendicular rows and columns comprises an initial phosphor deposition step in which phosphor ( 803, 905 ) is deposited at alternating locations (pixels) in the matrix array in a checkerboard pattern, so that the locations ( 504 ) in the array at which phosphor ( 803, 905 ) is deposited are not adjacent to each other. In a subsequent phosphor deposition step phosphor is deposited at the alternating locations at which phosphor was not deposited in the first deposition step. In between the two phosphor deposition steps, reflective or scattering structures ( 606 ) may be fabricated on sidewalls of the phosphor pixels to optically isolate pcLEDs in the resulting array from each other.