Melexis Technologies NV

Methods and devices for integrating temperature sensors directly into materials, structures, or challenging environments (e.g., hydrogen tanks, concrete, ocean) to measure internal or localized temperatures.

Systems and methods for dynamically adjusting light output, distribution, color, or intensity based on environmental conditions, user presence, content, or specific application needs.

Innovations in the physical design, materials, fabrication, or packaging of photodetectors and optical sensor elements, including thermoelectric, NIR-compliant, and self-mixing interference types, to improve performance or integration.

Techniques for determining the rotor position, speed, or other operational parameters of an electric motor without dedicated physical sensors, often relying on back-EMF, current, or voltage measurements.

Focuses on the physical design, materials, and methods for packaging capacitors and integrating them onto circuit boards, including external electrode structures, conductive adhesives, and mounting techniques to ensure reliable electrical and mechanical connections.

Focuses on the internal and external structural elements, material compositions (e.g., ceramic dielectrics, electrode metals), and manufacturing techniques used to create multilayer ceramic capacitors (MLCCs), including aspects like mechanical robustness and internal circuitry.

Describes capacitors designed with actively variable capacitance, often employing phase-change materials or mechanical actuation, for use in radio frequency (RF) components, reconfigurable intelligent surfaces, and other tunable electronic systems.

Sophisticated software or hardware-implemented control strategies that optimize motor performance, such as precise speed/torque regulation, vibration reduction, or efficiency, often using model-based, predictive, or adaptive techniques.

Techniques for measuring, monitoring, and compensating for temperature variations within semiconductor devices, integrated circuits, or photonic components to maintain performance, prevent degradation, and ensure reliability across operating conditions.

Measures force or pressure by detecting changes in electrical capacitance. This typically involves the deformation of a dielectric material or the relative movement of conductive plates, altering the distance or area between them.

Sensors that quantify strain or deformation by measuring the change in electrical resistance of a material, such as a semiconductor film or conductive layers, as it undergoes mechanical stress.

Innovations in the physical components and architectures of radar, lidar, and sonar systems, including antenna design, RF signal generation, beam steering mechanisms, and optical elements for improved performance.

Use of thermal and infrared sensors for non-contact temperature measurement, occupancy detection, structural health monitoring, fire/hazard detection, and process control in diverse industrial, environmental, and security applications.

Methods and devices that determine the position, angle, or distance of an object by detecting changes in magnetic fields or inductive coupling.

Design and implementation of capacitive sensors, including methods for improving accuracy, reducing power consumption, compensating for environmental variations (like temperature), and analyzing complex displacement interactions.

Methods and systems for identifying anomalies, failures, or impending issues within electric motors or their associated drive and power management circuits, often by monitoring electrical or operational parameters.

Methods and systems for accurately determining the absolute or relative position of an object or device, often integrating satellite navigation (GNSS), inertial measurement units (IMU), and local ranging or wireless communication technologies.

Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.

Systems and methods designed to improve the accuracy, reliability, or operational range of sensors and electronic components by measuring temperature and applying corrections or adjustments.

Methods and apparatus for measuring magnetic fields or utilizing magnetic resonance principles for medical diagnostics, material analysis, or precise localization, including gradient field measurement in MRI.

Methods and circuits for controlling the power electronic converters (inverters, bridges) that supply current and voltage to electric motors, including switching strategies, voltage command generation, and multi-phase configurations.

Strategies and circuits for optimizing the supply and consumption of electrical power for motors, including current limiting, regenerative energy handling, battery integration, and managing power quality.

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Advanced techniques for forming and optimizing gate dielectrics, work function layers, and other dielectric layers within transistor structures to improve performance, reliability, and scaling.

Development and manufacturing of semiconductor devices using wide bandgap materials like Silicon Carbide (SiC) or Gallium Nitride (GaN) for high-power, high-frequency, or high-temperature applications.

Temperature sensing systems integrated into wearable devices or medical apparatus for monitoring physiological conditions, such as inflammation detection, often utilizing differential temperature measurements.

Systems and methods for acquiring and analyzing image data across multiple discrete spectral bands or a continuous spectrum, often for material characterization, environmental monitoring, or remote sensing applications.

Sensors and systems designed to detect and quantify localized contact forces, pressure distribution, or touch interactions, often employed in robotics, human-machine interfaces, or object manipulation applications.

Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.