Merry Electronics(Shenzhen) Co., Ltd.

A listening device includes a housing and a circuit board assembly. The housing includes at least one sound outlet. The circuit board assembly is disposed on the housing and includes a microphone, a proximity sensing chip, and a proximity sensing pattern. The microphone and the proximity sensing chip are close to each other and are disposed in a first area of the circuit board assembly. The proximity sensing pattern is disposed in a second area of the circuit board assembly. The second area is connected to the first area. The proximity sensing pattern surrounds and is staggered with the at least one sound outlet.

A directional microelectromechanical systems (MEMS) microphone, including a first layer, a second layer, and a third layer stacked in sequence and multiple adhesive members formed between the first layer, the second layer, and the third layer, is provided. The adhesive members include an outer adhesive member disposed surrounding a periphery of the first layer, the second layer, and the third layer and an inner adhesive member disposed within a range surrounded by the outer adhesive member. The outer adhesive member and the inner adhesive member form at least two slits between the first layer, the second layer, and the third layer. An external sound is transmitted to a sound sensing element after passing through two receiving holes of the directional MEMS microphone respectively along two paths. One of the two paths passes through the at least two slits.

An outer ear structure of recording system includes a base, a first component and a second component. The base includes a first through hole extending along a first axis. The first component is disposed on the base and includes a second through hole corresponding to the first through hole and a recessed area surrounding the second through hole. The second component is disposed on the first component and is offset from the second through hole. An area of the second component is smaller than an area of the first component. The second component includes an inwardly curved side wall facing the first axis.

Disclosed is a microphone module including a casing, a microphone, a drainage structure, a waterproof membrane and a limiting member. The casing has a recess. The microphone is disposed in the casing, and corresponds to the recess. The drainage structure is disposed at the casing and includes a first channel and a second channel communicated to each other. A first sound hole of the first channel is exposed from the casing, and a second sound hole of the second channel corresponds to the microphone. A waterproof membrane is disposed in the recess and located between the microphone and the second sound hole. The limiting member is disposed in the recess and located between the microphone and the waterproof membrane.

Disclosed is a microphone module including a casing, a microphone, a drainage structure, and a waterproof membrane. The microphone is disposed in the casing. The drainage structure is disposed on the casing. The drainage structure includes a first channel and a second channel connected to each other. A first sound hole and a drainage hole of the first channel are exposed from the casing, and a second sound hole of the second channel corresponds to the microphone. A first normal line of the first sound hole is perpendicular to a second normal line of the second sound hole. The waterproof membrane is disposed on the casing and between the microphone and the second sound hole.

A micro-electromechanical packaging structure including a substrate, a sensing module, a waterproof layer, and a cover is provided. The substrate has a first surface, a second surface, and an acoustic hole penetrating through the first surface and the second surface. The acoustic hole has an upper opening and a lower opening, and an aperture of the lower opening is larger than an aperture of the upper opening. The sensing module is disposed on the first surface of the substrate and covers the upper opening. The waterproof layer is disposed on the second surface of the substrate and covers the lower opening. The waterproof layer has multiple fine holes. The fine holes are communicated with the acoustic hole. The cover is disposed on the first surface and covers the sensing module.

A speaker includes a frame, a magnetic circuit system, and a diaphragm structure. The magnetic circuit system is arranged in the frame. A central part of the diaphragm structure is located on a voice coil of the magnetic circuit system. A connecting part of the diaphragm structure surrounds an outer edge of the central part. A first end of the connecting part faces the voice coil, and a second end of the connecting part is provided with a protruding structure. A hanging edge of the diaphragm structure includes a first bending section and a second bending section connected to each other, and the second bending section is connected to the protruding structure. In a normal direction of a bottom surface of the frame, the protruding structure is higher than a connection between the first bending section and the second bending section.

A microphone having a light-emitting structure includes a housing, a main body, and multiple light-emitting structures. The main body is disposed in the housing. The light-emitting structures are disposed between the housing and the main body and fixed on the main body. Each of the light-emitting structures includes a light-emitting module and a light guide structure. The light-emitting module includes a circuit board and multiple light-emitting elements, and the light-emitting elements are disposed on the circuit board. The light guide structure includes a groove and a light guide part. The groove covers the light-emitting module. The light guide part is mountain-shaped and extends from the groove toward the housing.

An electronic device includes a substrate, a sensor, a pressurizing component, and a stopping structure. The substrate has a bearing surface. The sensor is disposed on the bearing surface. The pressurizing component is disposed on the sensor. The stopping structure is disposed between the pressurizing component and the sensor. The stopping structure has opposite upper and lower surfaces and a plurality of openings, and each opening penetrates from the upper surface to the lower surface.

A listening device includes a housing and a circuit board assembly. The housing includes at least one sound outlet. The circuit board assembly is disposed on the housing and includes a microphone, a proximity sensing chip, and a proximity sensing pattern. The microphone and the proximity sensing chip are close to each other and are disposed in a first area of the circuit board assembly. The proximity sensing pattern is disposed in a second area of the circuit board assembly. The second area is connected to the first area. The proximity sensing pattern surrounds and is staggered with the at least one sound outlet.