UnfoldIP

Company patents

Microfabrica Inc.

Microfabrica Inc. exhibits a highly concentrated patent strategy, with Electrical Measurement comprising nearly 90% of its portfolio. Surprisingly, despite this dominance, patenting in Electrical Measurement saw a dramatic 93.8% decline in 2025 after a massive 255.6% surge in 2024, indicating a volatile and potentially shifting focus within its core area, while other categories like Electrical Connectors also saw a complete cessation of patenting in 2025.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

48 US filings (since 2023) · 8 categories · 7 themes

Semiconductor Electrical Test

Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.

Electrical Measurement
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35since 2023
-92.0%YoY
Advanced Material Characterization

Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.

Electrical Measurement
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29since 2023
n/a
Substrate Patterning & Processing

Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.

Photolithography
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4since 2023
n/a
Robust Electrical Contact Systems

Design of contact elements and their interaction to ensure stable, low-resistance electrical connection under various mechanical and environmental conditions, including spring forces and material choices.

Electrical Connectors
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3since 2023
n/a
Package Thermal Management

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Semiconductor Manufacturing ProcessSemiconductor Packaging & Encapsulation
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2since 2023
new
Advanced Heat Exchanger Architectures

Novel designs and configurations for heat exchangers that improve heat transfer efficiency, compactness, or enable specific phase change or separation processes within refrigeration and heat pump cycles.

Heat Exchange Components
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2since 2023
new
Laser Material Processingfiltered

Techniques and systems utilizing laser beams for precise material modification, including cutting, cladding, ablation, and surface treatment, often for joining, shaping, or removing material.

Welding & Soldering
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2since 2023
n/a

Patents

Showing 1-2 of 2

Laser Material Processing
Page 1 of 1
US 11999016 B2GRANTED
B23K26/38

Methods of forming parts using laser machining

Filed:2022-04-18Pub:2024-06-04
Applicant:Microfabrica Inc.

Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

US 20230201968 A1APPLICATION
B23K26/38

Methods of Forming Parts Using Laser Machining

Filed:2022-04-18Pub:2023-06-29
Applicant:Microfabrica Inc.

Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

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