Murata Manufacturing Co., Ltd.

Methods and structures for encapsulating, interconnecting, and integrating impedance network components, particularly acoustic filters, into larger modules or systems.

Devices utilizing piezoelectric materials to generate and filter acoustic waves, often for radio frequency applications, including surface acoustic wave (SAW) and bulk acoustic wave (BAW) structures.

Focuses on the internal and external structural elements, material compositions (e.g., ceramic dielectrics, electrode metals), and manufacturing techniques used to create multilayer ceramic capacitors (MLCCs), including aspects like mechanical robustness and internal circuitry.

Focuses on the physical design, materials, and methods for packaging capacitors and integrating them onto circuit boards, including external electrode structures, conductive adhesives, and mounting techniques to ensure reliable electrical and mechanical connections.

Techniques for designing and manufacturing compact, multi-functional magnetic components, such as inductors, transformers, and coils, often involving embedded structures, multilayer designs, or shared magnetic circuits to achieve higher power density or smaller form factors.

Methods and structures for integrating and enclosing electronic components into compact, multi-functional modules, often involving embedded components, multi-layer substrates, and electromagnetic shielding for performance and miniaturization.

Explores the composition and integration of solid or gel-based electrolyte materials within various capacitor types, such as solid electrolytic capacitors and supercapacitors, to enhance performance, stability, and safety.

Circuit designs and control techniques focused on maximizing the power conversion efficiency of amplifiers, especially for radio frequency (RF) or audio applications, often involving load modulation, envelope tracking, or specific amplifier classes (e.g., Class-D, Doherty).

Techniques and structures used to reduce unwanted electromagnetic coupling, scattering, or interference between multiple antennas, different frequency bands, or sensitive electronic components within a device.

Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.

Slurry compositions and coating processes for battery electrodes, including binder/active-material slurries, surface coating layers, and electrode-to-foil adhesion for cathode and anode.

Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.

Amplifier designs that allow for dynamic adjustment of their operating characteristics, such as gain, impedance, or amplification path, based on control signals, input conditions, or desired performance modes.

Manufacturing processes and material compositions for creating electronic circuits on flexible or conformable substrates, enabling novel form factors, enhanced durability, and new applications beyond rigid PCBs.

Focuses on the structural integrity, housing, mounting, and physical integration of battery cells into robust and protected packs within electric vehicles, including manufacturing considerations.

Focuses on novel circuit configurations for DC-DC, DC-AC, or AC-DC conversion, often involving resonant operation, multi-level structures, or switched capacitors to improve efficiency, power density, or voltage conversion ratios.

Methods and circuits to detect and compensate for various imperfections in amplifier operation, such as DC offset, gain errors, phase errors, duty-cycle errors, or input error components, to improve accuracy and signal integrity.

Process and equipment for producing solid-state battery cells, including solid electrolyte synthesis (sulfide/oxide/polymer), thin-film deposition, lamination, sintering, dry-electrode fabrication, and stacking under controlled atmosphere.

Development and processing of metal powders with specific magnetic properties, including soft magnetic alloys, permanent magnet materials, and insulated powders for electronic components, often involving precise control of particle size, morphology, and composition.

Circuits designed to transform the impedance of a source to match the impedance of a load, maximizing power transfer or minimizing signal reflections, often involving inductors, capacitors, and transformers.

Software, algorithms, and associated hardware for monitoring, controlling, and optimizing battery performance, safety, and lifespan, including charge/discharge cycles, thermal regulation, and system integration.

Processes and apparatus for disassembling spent batteries and recovering valuable materials (e.g., metals, electrolytes, plastics) through mechanical, chemical, or electrochemical methods for reuse or sustainable disposal.

Involves the development of novel materials and porous structures for the electrodes of supercapacitors and other electrochemical energy storage devices, aiming for high charge density, improved performance, and flexibility.

Techniques and circuits designed to regulate output, manage input variations, mitigate resonance, or ensure stable operation of power converters under diverse load and source conditions. This includes adaptive, predictive, or fault-tolerant control schemes.

Systems and methods for electronically steering or shaping antenna beams by controlling the phase and amplitude of signals fed to individual elements in an array, including calibration techniques and multi-antenna configurations.

Methods and materials used to construct robust and protective enclosures for electronic devices, focusing on structural integrity, impact resistance, thermal dissipation, and specialized material properties for enhanced durability.

Design and assembly of power conversion, distribution, and protection modules, focusing on compact form factors, efficient electrical connections, and robust protective measures for electronic systems, often in high-power applications.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Novel materials and processes for forming low-resistance electrical contacts and interconnects within semiconductor devices, including selective deposition, silicidation, and barrier layers for improved performance and scaling.

Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.

Active anode materials and manufacturing techniques for rechargeable lithium-ion batteries, including silicon-carbon composites, graphite, lithium-metal anodes, and electrode coating processes that improve capacity, cycle life, and rate capability.

Circuitry and techniques specifically designed to amplify weak signals while minimizing the introduction of additional noise and maintaining high linearity, often incorporating impedance matching, parasitic neutralization, or protection circuits.

Specialized amplifier types designed for converting current to voltage (transimpedance) or voltage to current (transconductance), often featuring virtual ground configurations, precise gain setting, and compensation for input/output characteristics.

Describes capacitors designed with actively variable capacitance, often employing phase-change materials or mechanical actuation, for use in radio frequency (RF) components, reconfigurable intelligent surfaces, and other tunable electronic systems.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Development of novel materials and designs for bonding, sealing, and underfill applications, focusing on improving mechanical integrity, electrical performance, and preventing defects like cracks or delamination in chip-to-chip connections.

Systems and devices that utilize controlled magnetic fields, often generated by electromagnets, to produce mechanical motion, precise positioning, or manipulate physical phenomena like plasma distribution.

Materials and processes for hermetic encapsulation, conformal coating, optical chip sealing, and stretchable conductors for electronic and optoelectronic devices.

Integration of power converters with energy storage devices (batteries, supercapacitors) or grid interfaces, often involving AC/DC conversion, power flow management, and fault handling for hybrid power systems or specific applications like EVs or PV.

Methods for depositing thin films with controlled conformality, thickness, and material properties, including selective deposition on specific areas, often using atomic layer deposition (ALD), chemical vapor deposition (CVD), or epitaxial growth.

Development and application of resin compositions, molding compounds, and underfill materials to protect semiconductor devices from environmental factors, moisture, mechanical stress, and for structural integrity.

Combining different types of functional chiplets (e.g., compute, memory, I/O, optical, power, biological) into a single package or system, often to optimize performance, power, or cost by leveraging specialized components.

Technologies enabling dynamic control over electromagnetic wave propagation using arrays of passive or active elements (unit cells) to reflect, refract, or absorb signals, often for channel optimization or energy efficiency.

Systems designed to manage the temperature of multiple components in electric or hybrid vehicles, such as batteries, electric motors, power electronics, and the passenger cabin, often using shared or interconnected cooling/heating circuits.

Packaging technologies where bare dies are embedded within a mold compound or substrate cavity, and then interconnected using redistribution layers (RDLs) for fan-out or compact integration, often avoiding through-silicon vias in the chips themselves.

Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.