Company patents
NGK SPARK PLUG CO., LTD.
NGK SPARK PLUG CO., LTD. appears to be undergoing a significant strategic shift, as evidenced by the dramatic decline in patenting across nearly all its major categories, including Material & Chemical Analysis (21.1% of portfolio, -100.0% YoY in 2025), Cement & Ceramics (15.5% of portfolio, -100.0% YoY in 2024), and Semiconductor Manufacturing Process (11.3% of portfolio, -100.0% YoY in 2024), with almost no new patent activity observed in 2025 across its top categories, suggesting a potential re-evaluation or divestment of these previously core technology areas.
Patent Trend by Technology Area
Yearly patent publications since 2023
Product themes
Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.
71 US filings (since 2023) · 9 categories · 10 themes
Optical structures and lens designs that improve light extraction efficiency from LED dies and modules, including diffractive films, micro-lens arrays, reflectors, and color-conversion layers.
Ceramic materials and components engineered for specific functional applications, such as electronics, energy storage, wear resistance, or high-temperature heating elements.
Systems and methods for automated substrate transport, precise positioning, temperature regulation, and chamber environment management to ensure process stability, uniformity, and yield in semiconductor manufacturing.
Methods and components used to control the direction, spread, and intensity of light emitted from a source, including waveguides, lenses, diffusers, and louvers.
Composite materials where a metallic matrix is reinforced with a second phase (e.g., ceramic particles, carbon nanotubes, diamond grains) to significantly enhance properties like hardness, wear resistance, stiffness, or strength, often used in cutting tools, wear parts, or structural applications.
Methods and compositions for applying metallic or alloy layers to a substrate, or modifying the surface of an alloy, to impart specific functional properties such as corrosion resistance, wear resistance, electrical insulation, or improved adhesion, without altering the bulk properties significantly.
Methods for temporarily attaching a wafer or substrate to a carrier for thinning, dicing, or other processing, followed by controlled debonding, often using light-sensitive resins, temporary adhesives, or roughened interfaces.
Methods and processes for fabricating ceramic matrix composites (CMCs), including preform creation, infiltration techniques, and densification to form complex shapes with enhanced properties.
Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.
Design and application of devices that are inserted into the body or implanted to treat diseases, modulate physiological functions, or repair anatomical structures.
Patents
Showing 1-10 of 266