Northrop Grumman Systems Corporation

Devices leveraging superconductivity or quantum phenomena for applications such as quantum computing, high-efficiency power transmission, or sensitive detection, including materials like graphene Josephson junctions and quantum bits.

Specialized digital and mixed-signal circuits for controlling and reading out quantum bits (qubits), including generating precise modulated RF signals and integrating with photonic components for quantum operations.

Systems and methods for electronically steering or shaping antenna beams by controlling the phase and amplitude of signals fed to individual elements in an array, including calibration techniques and multi-antenna configurations.

Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.

Development of memory cells utilizing resistive switching or phase-change materials, including novel material compositions, multi-layered structures, and integration with selector devices like bipolar junction transistors, to achieve non-volatile storage.

Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.

Circuits and techniques for generating, synchronizing, interpolating, and recovering high-frequency clock signals and high-speed data streams, often involving reduced propagation delay, multi-level signaling, and robust sampling mechanisms.

Methods and tooling for forming structural components from fibrous materials impregnated with resin, involving processes like prepreg handling, resin infusion, and co-bonding during curing.

Techniques for combining multiple materials or layers, often with specialized surface treatments, coatings, or assembly methods, to create functional or aesthetically enhanced plastic articles, including consumer goods and encapsulated electronics.

Techniques for building three-dimensional metal objects layer-by-layer using metal powders, including powder bed fusion, binder jetting, and directed energy deposition. This theme encompasses process mechanics, equipment design, and operational control for AM systems.

Methods and structures for encapsulating, interconnecting, and integrating impedance network components, particularly acoustic filters, into larger modules or systems.

Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.

Techniques and apparatus for electrically testing semiconductor devices, integrated circuits, or wafers during manufacturing or post-assembly, including built-in self-test (BIST) and contact reliability assessment.

Integration of additive manufacturing with subtractive manufacturing (e.g., machining, cutting) or other traditional processes within a single system or workflow to create parts with improved features, surface finish, or material properties, or to enable new manufacturing paradigms.

The design and manufacturing of integrated circuits that combine optical and electronic components, particularly for high-speed data communication between processors and memory.

Design and integration of thermoelectric modules for converting heat into electricity (power generation) or using electricity for cooling/heating, often involving p-type/n-type semiconductor pellets and waste heat recovery.

Techniques and structures used to reduce unwanted electromagnetic coupling, scattering, or interference between multiple antennas, different frequency bands, or sensitive electronic components within a device.

Integrated solutions for dissipating heat generated by high-density semiconductor devices within the package, including embedded cooling structures, cold plates, and optimized fluidic channels.

Devices utilizing piezoelectric materials to generate and filter acoustic waves, often for radio frequency applications, including surface acoustic wave (SAW) and bulk acoustic wave (BAW) structures.

Utilizing dedicated hardware components, secure enclaves, or trusted execution environments to perform cryptographic operations, enhancing security, performance, or isolation from software vulnerabilities.

Development of sophisticated optical lens assemblies and computational methods to achieve high-resolution, precise, or specialized imaging, often for medical or scientific applications.

Circuits designed to transform the impedance of a source to match the impedance of a load, maximizing power transfer or minimizing signal reflections, often involving inductors, capacitors, and transformers.

Systems and methods that utilize optical fibers as sensing elements or for transmitting sensing signals, often for distributed monitoring of environmental conditions, phase changes, or integrating sensing with communication.

Systems and methods for encrypting data at a fine-grained level (e.g., per data unit or based on sensitivity) and controlling access to it, often involving delegated authorization, contextual policies, or secure data sharing.

Techniques for protecting data at rest or in backup, ensuring its integrity, confidentiality, and verifiable origin, often involving encryption, unique identifiers, or secure repositories.

Digital logic circuits designed to interface with analog sensors or signals, including comparators, input buffers, differential input stages, and logic for processing sensor outputs (e.g., capacitance, optical, touch) for detection or measurement.

Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.

Engineering of artificial subwavelength structures (meta-atoms) to create metasurfaces that manipulate light properties (phase, polarization, wavelength) for multi-functional optical devices.

Applying artificial intelligence and machine learning techniques to enhance cryptographic systems, such as generating encryption models, improving zero-trust architectures, or enabling privacy-preserving computations like federated learning.

Utilizing machine learning, particularly deep learning, to analyze medical data such as images, sensor readings, or physiological signals for disease prediction, diagnosis, or treatment assessment.

Specialized hardware, architectural designs, and computational methods to improve the speed, efficiency, and security of artificial intelligence and machine learning model execution, particularly for inference and data processing.

Methods and systems for generating, distributing, updating, rotating, and securely destroying cryptographic keys to maintain data confidentiality and integrity over time, including quantum key distribution.

Digital logic and control circuits for managing power delivery, driving various loads (e.g., inductive, display elements), converting power, and protecting against over-voltage or electrostatic discharge. Includes gate drivers for power FETs and voltage level shifters.

Novel electrical connection methods within or between package components, including through-glass vias (TGVs), backside contacts, and optimized redistribution layers for improved signal and power integrity.

Methods for training machine learning models across multiple decentralized devices or servers while keeping data localized, often involving aggregation of model parameters and secure communication.

Methods and systems for identifying anomalies, failures, or impending issues within electric motors or their associated drive and power management circuits, often by monitoring electrical or operational parameters.

Optical systems and components specifically designed for head-mounted displays, augmented reality (AR) glasses, and virtual reality (VR) headsets, focusing on image projection, waveguide integration, and display durability.

Mechanisms to facilitate the secure exchange of data between different entities or systems while enforcing usage policies, managing digital content rights, and ensuring data consistency during replication or transfer.

Techniques for stacking multiple semiconductor dies or active layers vertically to achieve higher density and shorter interconnections, often utilizing through-silicon vias (TSVs) or other vertical conductive paths like through-hole electrodes.

Focuses on using distributed ledger technology (DLT) like blockchain to secure financial transactions, manage digital identities, or ensure data integrity and traceability across various applications.