Company patents

Nova Ltd.

Nova Ltd.'s patent strategy shows a strong, sustained focus on core areas like Material & Chemical Analysis (50.0% of portfolio) and Photolithography (46.9%), despite a notable decline in filings across most categories so far in 2026. Surprisingly, while Semiconductor Testing saw rapid growth of +150.0% in 2024, it, along with Machine Learning & AI, has seen a complete halt in new patent filings in 2026, suggesting a potential shift in R&D priorities away from these previously emerging areas.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

96 US filings (since 2023) · 12 categories · 17 themes

Optical & Image-based Metrology

Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.

Semiconductor Testing
Who else files here? →
60since 2023
+18.8%YoY
Lithography Metrology & Inspection

Techniques and apparatus for measuring critical dimensions, overlay accuracy, defect detection, and surface topography in lithographic processes, often involving optical, laser, or charged particle beams.

Photolithography
Who else files here? →
47since 2023
0.0%YoY
Advanced Material Characterization

Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.

Semiconductor Testing
Who else files here? →
34since 2023
-31.2%YoY
Optical 3D Surface Metrology

Techniques and systems for measuring three-dimensional shapes, depths, or surface profiles using optical principles, including diffraction, interferometry, structured light, and imaging.

Length / Distance Measurement
Who else files here? →
28since 2023
-11.1%YoY
Spectroscopic Material & Process Analysis

Techniques and apparatus utilizing various spectroscopy methods (e.g., Raman, NIRS, photometric, interferometric) for identifying substances, measuring concentrations, or monitoring chemical and physical processes in industrial, environmental, or laboratory settings.

Photometry / Spectrometry
Who else files here? →
26since 2023
-36.4%YoY
In-situ Process Monitoring

Techniques and systems for real-time or near-real-time measurement and adjustment of semiconductor manufacturing parameters (e.g., temperature, etch rate, ion beam uniformity) to ensure process quality and consistency.

Semiconductor Testing
Who else files here? →
16since 2023
-28.6%YoY
Advanced Optical Sensor Components

Innovations in the physical design, materials, fabrication, or packaging of photodetectors and optical sensor elements, including thermoelectric, NIR-compliant, and self-mixing interference types, to improve performance or integration.

Photometry / Spectrometry
Who else files here? →
5since 2023
0.0%YoY
AM Process Monitoring & Control

Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.

Industrial Control Systems
Who else files here? →
4since 2023
+100.0%YoY
Substrate Patterning & Processing

Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.

Photolithography
Who else files here? →
2since 2023
0.0%YoY
Advanced Etching & Patterning Control

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Semiconductor Manufacturing Process
Who else files here? →
2since 2023
n/a
Photolithography Process Modeling

Computational methods for modeling and simulating photolithography processes, including mask design, aerial image generation, and defect prediction for semiconductor manufacturing.

Electronic Design Automation (CAD/EDA)
Who else files here? →
2since 2023
n/a
Phased Array & Beamforming Antennas

Systems and methods for electronically steering or shaping antenna beams by controlling the phase and amplitude of signals fed to individual elements in an array, including calibration techniques and multi-antenna configurations.

Antennas
Who else files here? →
2since 2023
n/a
Automated Visual Inspection

Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.

Material & Chemical Analysis
Who else files here? →
1since 2023
n/a
On-chip Test Structures

Integration of dedicated physical structures or built-in circuitry within semiconductor devices to enable characterization of process variations, material properties, electrical leakage, or device performance.

Semiconductor Testing
Who else files here? →
1since 2023
n/a
Integrated & Embedded Antennas

Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.

Antennas
Who else files here? →
1since 2023
n/a
Multi-Band & Broadband Antenna Design

Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.

Antennas
Who else files here? →
1since 2023
n/a
Reconfigurable Intelligent Surfaces (RIS)

Technologies enabling dynamic control over electromagnetic wave propagation using arrays of passive or active elements (unit cells) to reflect, refract, or absorb signals, often for channel optimization or energy efficiency.

Antennas
Who else files here? →
1since 2023
n/a

Patents

Showing 31-40 of 121

Page 4 of 13
US 20250054128 A1APPLICATION
G06T7/00

METHOD AND SYSTEM FOR OPTIMIZING OPTICAL INSPECTION OF PATTERNED STRUCTURES

Filed:2024-07-30Pub:2025-02-13
Applicant:NOVA LTD.

A system for use in metrology of a patterned structure, the system which includes a data input utility configured to receive: first type of data related to the patterned structure, the first type of data was obtained by a first type of metrology system and comprises first type measurements and first geometrical information regarding the patterned structure; second type of data related to the patterned structure, the second type of data was obtained by a second type of metrology system and comprises second type measurement results and second geometrical information regarding the patterned structure; the second type of metrology system differs from the first type of metrology system, and a data processing and analyzing utility configured to determine values of parameters of interest based on the first type of data and the second type of data. The parameters of interest comprise (i) a first parameter of interest that is related to the first type of metrology and (ii) a second parameter of interest that is related to the second type of metrology; in which the first parameter of interest is a parameter of a first model for interpreting the first type of measurements; in which the second parameter of interest is a parameter of a second model for interpreting the second type of measurements; wherein the data processing and analyzing utility is configured to determine values of parameters of interest by applying an iterative process, wherein the iterative process comprises updating the first model based on the second type of data to provide a currently updated first model and updating the second model based on the first type of data. The first type measurements and the second type measurements are taken from measurement sites of a substrate that comprises the patterned structure; wherein the data processing and analyzing utility configured to adjust the first type measurements by using correlation curves to provide adjusted first type measurements, and use the adjusted first type measurements during a data interpretation process applied on the second type of data, in which the data processing and analyzing utility is configured to reduce a number of floating parameters of the data interpretation process to provide a reduced number of floating parameters by stabilizing measurements of non-floating parameters; wherein each of the non-floating parameters has a greater impact on the first type measurements than an impact of each of the reduced number of floating parameters.