Company patents

Nova Ltd.

Nova Ltd.'s patent strategy shows a strong, sustained focus on core areas like Material & Chemical Analysis (50.0% of portfolio) and Photolithography (46.9%), despite a notable decline in filings across most categories so far in 2026. Surprisingly, while Semiconductor Testing saw rapid growth of +150.0% in 2024, it, along with Machine Learning & AI, has seen a complete halt in new patent filings in 2026, suggesting a potential shift in R&D priorities away from these previously emerging areas.

Patent Trend by Technology Area

Yearly patent publications since 2023

Product themes

Product-level themes inferred from filings since 2023, with category chips showing where each theme appears. Select a theme to filter the patents below.

96 US filings (since 2023) · 12 categories · 17 themes

Optical & Image-based Metrology

Utilizing optical systems, cameras, and image processing algorithms for precise measurement of physical dimensions, alignment, defects, and features on semiconductor wafers or packages.

Semiconductor Testing
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60since 2023
+18.8%YoY
Lithography Metrology & Inspection

Techniques and apparatus for measuring critical dimensions, overlay accuracy, defect detection, and surface topography in lithographic processes, often involving optical, laser, or charged particle beams.

Photolithography
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47since 2023
0.0%YoY
Advanced Material Characterization

Techniques and systems for precisely measuring electrical or electromagnetic properties of materials or components, often involving specialized resonators, waveguides, or multi-range measurement systems to ensure accuracy.

Semiconductor Testing
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34since 2023
-31.2%YoY
Optical 3D Surface Metrology

Techniques and systems for measuring three-dimensional shapes, depths, or surface profiles using optical principles, including diffraction, interferometry, structured light, and imaging.

Length / Distance Measurement
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28since 2023
-11.1%YoY
Spectroscopic Material & Process Analysis

Techniques and apparatus utilizing various spectroscopy methods (e.g., Raman, NIRS, photometric, interferometric) for identifying substances, measuring concentrations, or monitoring chemical and physical processes in industrial, environmental, or laboratory settings.

Photometry / Spectrometry
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26since 2023
-36.4%YoY
In-situ Process Monitoring

Techniques and systems for real-time or near-real-time measurement and adjustment of semiconductor manufacturing parameters (e.g., temperature, etch rate, ion beam uniformity) to ensure process quality and consistency.

Semiconductor Testing
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16since 2023
-28.6%YoY
Advanced Optical Sensor Components

Innovations in the physical design, materials, fabrication, or packaging of photodetectors and optical sensor elements, including thermoelectric, NIR-compliant, and self-mixing interference types, to improve performance or integration.

Photometry / Spectrometry
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5since 2023
0.0%YoY
AM Process Monitoring & Control

Systems and methods for real-time sensing, modeling, and closed-loop control of additive manufacturing parameters to ensure part quality, consistency, and process efficiency. This includes thermal management, atmospheric regulation, and precise material deposition.

Industrial Control Systems
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4since 2023
+100.0%YoY
Substrate Patterning & Processing

Methods and equipment for applying photoresist uniformly onto wafers, forming patterns through various exposure techniques (e.g., direct imaging, multi-exposure), and integrating patterned layers into semiconductor structures or packaging.

Photolithography
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2since 2023
0.0%YoY
Advanced Etching & Patterning Control

Techniques for precise material removal, pattern shaping, and controlling etch selectivity or uniformity, often involving plasma, wet chemistry, or directed beams to achieve desired features on semiconductor substrates.

Semiconductor Manufacturing Process
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2since 2023
n/a
Photolithography Process Modeling

Computational methods for modeling and simulating photolithography processes, including mask design, aerial image generation, and defect prediction for semiconductor manufacturing.

Electronic Design Automation (CAD/EDA)
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2since 2023
n/a
Phased Array & Beamforming Antennas

Systems and methods for electronically steering or shaping antenna beams by controlling the phase and amplitude of signals fed to individual elements in an array, including calibration techniques and multi-antenna configurations.

Antennas
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2since 2023
n/a
Automated Visual Inspection

Systems that employ imaging and image processing to automatically detect defects, verify states, or ensure quality control in manufactured goods, printed materials, or industrial processes.

Material & Chemical Analysis
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1since 2023
n/a
On-chip Test Structures

Integration of dedicated physical structures or built-in circuitry within semiconductor devices to enable characterization of process variations, material properties, electrical leakage, or device performance.

Semiconductor Testing
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1since 2023
n/a
Integrated & Embedded Antennas

Design and manufacturing techniques for incorporating antenna structures directly into electronic devices, product housings, or materials, often under constraints of space, aesthetics, or environmental factors.

Antennas
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1since 2023
n/a
Multi-Band & Broadband Antenna Design

Antennas engineered to operate effectively across a wide continuous range of frequencies (broadband) or multiple distinct frequency bands, often requiring specific radiating element geometries or impedance matching circuits.

Antennas
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1since 2023
n/a
Reconfigurable Intelligent Surfaces (RIS)

Technologies enabling dynamic control over electromagnetic wave propagation using arrays of passive or active elements (unit cells) to reflect, refract, or absorb signals, often for channel optimization or energy efficiency.

Antennas
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1since 2023
n/a

Patents

Showing 61-70 of 121

Page 7 of 13
US 11906451 B2GRANTED
G01N23/2273

Method and system for non-destructive metrology of thin layers

Filed:2021-09-20Pub:2024-02-20
Applicant:Nova Ltd.

A monitoring system and method are provided for determining at least one property of an integrated circuit (IC) comprising a multi-layer structure formed by at least a layer on top of an underlayer. The monitoring system receives measured data comprising data indicative of optical measurements performed on the IC, data indicative of x-ray photoelectron spectroscopy (XPS) measurements performed on the IC and data indicative of x-ray fluorescence spectroscopy (XRF) measurements performed on the IC. An optical data analyzer module analyzes the data indicative of the optical measurements and generates geometrical data indicative of one or more geometrical parameters of the multi-layer structure formed by at least the layer on top of the underlayer. An XPS data analyzer module analyzes the data indicative of the XPS measurements and generates geometrical and material related data indicative of geometrical and material composition parameters for said layer and data indicative of material composition of the underlayer. An XRF data analyzer module analyzes the data indicative of the XRF measurements and generates data indicative of amount of a predetermined material composition in the multi-layer structure. A data interpretation module generates combined data received from analyzer modules and processes the combined data and determines the at least one property of at least one layer of the multi-layer structure.

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